Global Patent Index - EP 0980586 A1

EP 0980586 A1 20000223 - POWER SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE

Title (en)

POWER SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE

Title (de)

LEISTUNGSHALBLEITERMODUL MIT KERAMIKSUBSTRAT

Title (fr)

MODULE A SEMI-CONDUCTEUR DE PUISSANCE AVEC SUBSTRAT EN CERAMIQUE

Publication

EP 0980586 A1 20000223 (DE)

Application

EP 98933467 A 19980507

Priority

  • DE 9801266 W 19980507
  • DE 19719703 A 19970509

Abstract (en)

[origin: DE19719703A1] The invention relates to a power semiconductor module in which the connection elements (11) are pressed into openings in the plastic housing. This prevents the connection elements (11) from coming loose in the plastic housing (9), thus enhancing the reliability of the internal bonds (8) between the substrate (4) and the connection element (11).

IPC 1-7

H01L 23/24; H01L 23/053

IPC 8 full level

H01L 23/28 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)

CPC (source: EP)

H01L 23/24 (2013.01); H01L 23/49861 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01)

C-Set (source: EP)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2924/181 + H01L 2924/00012
  3. H01L 2924/00014 + H01L 2224/45099
  4. H01L 2924/00014 + H01L 2224/05599
  5. H01L 2924/00014 + H01L 2224/85399
  6. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/207

Citation (search report)

See references of WO 9852221A1

Designated contracting state (EPC)

DE FR GB IE IT

DOCDB simple family (publication)

DE 19719703 A1 19981112; DE 19719703 C2 20030410; DE 19719703 C5 20051117; EP 0980586 A1 20000223; JP 2001525126 A 20011204; WO 9852221 A1 19981119

DOCDB simple family (application)

DE 19719703 A 19970509; DE 9801266 W 19980507; EP 98933467 A 19980507; JP 54868598 A 19980507