EP 0983714 A2 20000308 - METHOD AND ARRANGEMENT FOR HEATING A COMPONENT
Title (en)
METHOD AND ARRANGEMENT FOR HEATING A COMPONENT
Title (de)
VERFAHREN UND VORRICHTUNG ZUM HEIZEN VON EINEM BAUTEIL
Title (fr)
PROCEDE ET DISPOSITIF SERVANT A RECHAUFFER UN COMPOSANT
Publication
Application
Priority
- FI 9700834 W 19971230
- FI 965301 A 19961231
Abstract (en)
[origin: WO9830075A2] The invention relates to a method and arrangement for heating at least one component (14) of a circuit board comprising one or plural layers (10 and 11). At least one component (14) to be heated is then heated with at least one heat resistor (15) associated with the circuit board.
IPC 1-7
IPC 8 full level
H05B 3/68 (2006.01); H01L 23/34 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H01L 23/34 (2013.01); H01L 23/345 (2013.01); H05K 1/0212 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01); H05K 1/167 (2013.01); H05K 3/4611 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1115 (2013.01); H05K 2203/165 (2013.01)
Citation (search report)
See references of WO 9830075A2
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9830075 A2 19980709; WO 9830075 A3 19980827; AU 5323998 A 19980731; AU 728378 B2 20010111; EP 0983714 A2 20000308; FI 965301 A0 19961231; FI 965301 A 19980701; JP 2001508942 A 20010703; NO 993236 D0 19990629; NO 993236 L 19990629
DOCDB simple family (application)
FI 9700834 W 19971230; AU 5323998 A 19971230; EP 97950212 A 19971230; FI 965301 A 19961231; JP 52965898 A 19971230; NO 993236 A 19990629