EP 0985231 A1 20000315 - MICROELECTRONIC CONTACT STRUCTURES
Title (en)
MICROELECTRONIC CONTACT STRUCTURES
Title (de)
MIKROELEKTRONISCHE KONTAKTSTRUKTUREN
Title (fr)
STRUCTURES DE CONTACT MICRO-ELECTRONIQUES
Publication
Application
Priority
- US 9809999 W 19980514
- US 9708634 W 19970515
- US 7367998 P 19980204
- US 3247398 A 19980226
Abstract (en)
[origin: WO9852224A1] Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, 322, 422) in the masking layer, depositing a conductive trace of a seed layer (250, 350, 450) onto the masking layer and into the openings, and building up a mass of conductive material on the conductive trace. The sidewalls of the opening can be sloped (tapered). The conductive trace can be patterned by depositing material through a stencil or shadow mask (240, 340, 440). A protruding feature (230, 430) may be disposed on the masking layer so that a tip end (264, 364, 464) of the contact structure acquires a topography. All of these elements can be constructed as a group to form a plurality of precisely positioned resilient contact structures.
IPC 1-7
IPC 8 full level
H01L 21/20 (2006.01); H01L 21/3205 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/12 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01); H01L 23/522 (2006.01); H01R 4/48 (2006.01); H01R 12/16 (2006.01); H01R 13/24 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP KR)
H01L 21/4853 (2013.01 - EP); H01L 23/49811 (2013.01 - EP); H01L 23/522 (2013.01 - EP); H01L 24/02 (2013.01 - EP); H01L 24/03 (2013.01 - KR); H01L 24/11 (2013.01 - EP KR); H01L 24/13 (2013.01 - EP); H01L 24/14 (2013.01 - EP); H01L 24/16 (2013.01 - EP); H01L 24/72 (2013.01 - EP); H01L 24/03 (2013.01 - EP); H01L 24/05 (2013.01 - EP); H01L 24/81 (2013.01 - EP); H01L 24/94 (2013.01 - EP); H01L 2224/02311 (2013.01 - EP); H01L 2224/02313 (2013.01 - EP); H01L 2224/0239 (2013.01 - EP); H01L 2224/036 (2013.01 - EP); H01L 2224/03912 (2013.01 - EP); H01L 2224/0401 (2013.01 - EP); H01L 2224/05166 (2013.01 - EP); H01L 2224/05644 (2013.01 - EP); H01L 2224/05666 (2013.01 - EP); H01L 2224/11003 (2013.01 - EP); H01L 2224/11005 (2013.01 - EP); H01L 2224/11334 (2013.01 - EP); H01L 2224/11426 (2013.01 - EP); H01L 2224/1143 (2013.01 - EP); H01L 2224/1145 (2013.01 - EP); H01L 2224/11452 (2013.01 - EP); H01L 2224/11462 (2013.01 - EP); H01L 2224/11464 (2013.01 - EP); H01L 2224/11472 (2013.01 - EP); H01L 2224/11474 (2013.01 - EP); H01L 2224/11823 (2013.01 - EP); H01L 2224/119 (2013.01 - EP); H01L 2224/13012 (2013.01 - EP); H01L 2224/13015 (2013.01 - EP); H01L 2224/13016 (2013.01 - EP); H01L 2224/13017 (2013.01 - EP); H01L 2224/13018 (2013.01 - EP); H01L 2224/13019 (2013.01 - EP); H01L 2224/13024 (2013.01 - EP); H01L 2224/1308 (2013.01 - EP); H01L 2224/13082 (2013.01 - EP); H01L 2224/13083 (2013.01 - EP); H01L 2224/13084 (2013.01 - EP); H01L 2224/131 (2013.01 - EP); H01L 2224/13109 (2013.01 - EP); H01L 2224/13111 (2013.01 - EP); H01L 2224/13113 (2013.01 - EP); H01L 2224/13116 (2013.01 - EP); H01L 2224/13139 (2013.01 - EP); H01L 2224/13144 (2013.01 - EP); H01L 2224/13147 (2013.01 - EP); H01L 2224/13155 (2013.01 - EP); H01L 2224/13157 (2013.01 - EP); H01L 2224/1316 (2013.01 - EP); H01L 2224/13163 (2013.01 - EP); H01L 2224/13164 (2013.01 - EP); H01L 2224/13166 (2013.01 - EP); H01L 2224/13169 (2013.01 - EP); H01L 2224/13173 (2013.01 - EP); H01L 2224/13176 (2013.01 - EP); H01L 2224/13178 (2013.01 - EP); H01L 2224/1318 (2013.01 - EP); H01L 2224/13184 (2013.01 - EP); H01L 2224/13562 (2013.01 - EP); H01L 2224/13644 (2013.01 - EP); H01L 2224/145 (2013.01 - EP); H01L 2224/16145 (2013.01 - EP); H01L 2224/16227 (2013.01 - EP); H01L 2224/81801 (2013.01 - EP); H01L 2224/94 (2013.01 - EP); H01L 2924/381 (2013.01 - EP); H05K 3/4092 (2013.01 - EP)
Citation (search report)
See references of WO 9852224A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9852224 A1 19981119; AU 7491598 A 19981208; EP 0985231 A1 20000315; JP 2000512437 A 20000919; JP 2002231718 A 20020816; JP 2003031289 A 20030131; JP 3378259 B2 20030217; KR 100577131 B1 20060510; KR 100577132 B1 20060509; KR 20010012575 A 20010215; KR 20040034685 A 20040428
DOCDB simple family (application)
US 9809999 W 19980514; AU 7491598 A 19980514; EP 98922344 A 19980514; JP 2001378598 A 20011212; JP 2002152167 A 20020527; JP 54959498 A 19980514; KR 19997010532 A 19991115; KR 20047003178 A 19980514