Global Patent Index - EP 0986197 A2

EP 0986197 A2 2000-03-15 - Optical transmitting/receiving method and apparatus

Title (en)

Optical transmitting/receiving method and apparatus

Title (de)

Optisches Sende/Empfangsverfahren und Vorrichtung

Title (fr)

Méthode et dispositif de transmission/réception optique

Publication

EP 0986197 A2 (EN)

Application

EP 99117225 A

Priority

JP 25241698 A

Abstract (en)

It is the object of the present invention to provide the optical transmitting/receiving method in which optical parts and electronic parts are mixed in the mounting structure on the same substrate to enable mounting such optical parts and electronic parts in the higher density and efficiency. A couple of plane type optical emitting/receiving elements (12a, 12b) are face-down mounted by the flip chip joining method on the upper surface of the multilayer substrate (10) and the through-holes (14a, 14b) are respectively formed at the area just under the center of plane type optical emitting/receiving elements (12a, 12b). At the internal wall of through-holes (14a, 14b), the clad layer consisting of conductive layer where the plating process is conducted at the surface thereof is formed and the core layer consisting of the polymer resin is also formed at the center. At the lower surface of multilayer substrate (10), the optical waveguide (22) extending linearly up to the area just under the other through-hole from the area just under one through-hole is formed. Moreover, the 45 DEG micro-mirrors (28a, 28b) are respectively formed at both end faces of the optical waveguide (22). <IMAGE>

IPC 1-7 (main, further and additional classification)

H04B 10/10

IPC 8 full level (invention and additional information)

G02B 6/122 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 31/0232 (2014.01); H04B 10/40 (2013.01); H04B 10/43 (2013.01); H04B 10/50 (2013.01); H04B 10/572 (2013.01); H04B 10/60 (2013.01); H04B 10/80 (2013.01); H05K 1/02 (2006.01); G02B 6/12 (2006.01)

CPC (invention and additional information)

H05K 1/0274 (2013.01); G02B 6/42 (2013.01); G02B 6/43 (2013.01); H04B 10/801 (2013.01); G02B 6/4214 (2013.01); G02B 6/4232 (2013.01); G02B 2006/12104 (2013.01)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

EP 0986197 A2 20000315; JP 2000081524 A 20000321; US 6330377 B1 20011211

INPADOC legal status


2002-12-11 [18W] WITHDRAWN

- Ref Legal Event Code: 18W

- Date of withdrawal: 20021018

2000-03-15 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2000-03-15 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO

- Ref Legal Event Code: AX

- Free Format Text: AL;LT;LV;MK;RO;SI