EP 0986197 A2 20000315 - Optical transmitting/receiving method and apparatus
Title (en)
Optical transmitting/receiving method and apparatus
Title (de)
Optisches Sende/Empfangsverfahren und Vorrichtung
Title (fr)
Méthode et dispositif de transmission/réception optique
Publication
Application
Priority
JP 25241698 A 19980907
Abstract (en)
It is the object of the present invention to provide the optical transmitting/receiving method in which optical parts and electronic parts are mixed in the mounting structure on the same substrate to enable mounting such optical parts and electronic parts in the higher density and efficiency. A couple of plane type optical emitting/receiving elements (12a, 12b) are face-down mounted by the flip chip joining method on the upper surface of the multilayer substrate (10) and the through-holes (14a, 14b) are respectively formed at the area just under the center of plane type optical emitting/receiving elements (12a, 12b). At the internal wall of through-holes (14a, 14b), the clad layer consisting of conductive layer where the plating process is conducted at the surface thereof is formed and the core layer consisting of the polymer resin is also formed at the center. At the lower surface of multilayer substrate (10), the optical waveguide (22) extending linearly up to the area just under the other through-hole from the area just under one through-hole is formed. Moreover, the 45 DEG micro-mirrors (28a, 28b) are respectively formed at both end faces of the optical waveguide (22). <IMAGE>
IPC 1-7
IPC 8 full level
G02B 6/122 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 31/0232 (2014.01); H04B 10/40 (2013.01); H04B 10/43 (2013.01); H04B 10/50 (2013.01); H04B 10/572 (2013.01); H04B 10/60 (2013.01); H04B 10/80 (2013.01); H05K 1/02 (2006.01); G02B 6/12 (2006.01)
CPC (source: EP US)
G02B 6/42 (2013.01 - EP US); G02B 6/43 (2013.01 - EP US); H04B 10/801 (2013.01 - EP US); H05K 1/0274 (2013.01 - EP US); G02B 6/4214 (2013.01 - EP US); G02B 6/4232 (2013.01 - EP US); G02B 2006/12104 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0986197 A2 20000315; JP 2000081524 A 20000321; US 6330377 B1 20011211
DOCDB simple family (application)
EP 99117225 A 19990901; JP 25241698 A 19980907; US 38540199 A 19990830