EP 0988500 A1 20000329 - SOLVENTLESS FORMING METHOD FOR HEAT EXCHANGER PANELS
Title (en)
SOLVENTLESS FORMING METHOD FOR HEAT EXCHANGER PANELS
Title (de)
LÖSUNGSMITTELFREIES HERSTELLUNGSVERFAHREN VON PLATTENWÄRMETAUSCHERN
Title (fr)
PROCEDE DE FORMAGE SANS SOLVANT POUR PANNEAUX D'ECHANGEUR THERMIQUE
Publication
Application
Priority
- CA 9800569 W 19980605
- US 4884297 P 19970606
- US 8988898 A 19980604
Abstract (en)
[origin: WO9855815A1] A method for forming thermoplastic heat exchanger panels without using solvents, wherein a co-extruded film is used to provide a layer of toughened, heat-sealable nylon on a layer of regular nylon, and using such panels in a gas-assisted press bonding process to form the heat exchanger panels.
IPC 1-7
IPC 8 full level
B29C 49/00 (2006.01); B29C 49/02 (2006.01); B29C 51/02 (2006.01); B29C 69/00 (2006.01); B32B 27/34 (2006.01); C08G 81/00 (2006.01); C08L 77/00 (2006.01); F28F 21/06 (2006.01)
CPC (source: EP US)
B29C 49/0005 (2013.01 - EP); B29C 49/0691 (2022.05 - EP); B29C 51/267 (2013.01 - EP); B32B 3/266 (2013.01 - US); B32B 3/30 (2013.01 - US); B32B 27/08 (2013.01 - US); B32B 27/34 (2013.01 - EP US); F28F 3/14 (2013.01 - EP); F28F 21/065 (2013.01 - EP); B29C 2049/78645 (2022.05 - EP); B29K 2077/00 (2013.01 - EP); B29L 2009/00 (2013.01 - EP); B29L 2031/18 (2013.01 - EP); B32B 2309/02 (2013.01 - US)
Citation (search report)
See references of WO 9855815A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 9855815 A1 19981210; CA 2294866 A1 19981210; EP 0988500 A1 20000329; JP 2002504870 A 20020212
DOCDB simple family (application)
CA 9800569 W 19980605; CA 2294866 A 19980605; EP 98928030 A 19980605; JP 50119999 A 19980605