EP 0993606 A1 20000419 - MEASURING ADDITIVE CONCENTRATION IN AN ELECTROPLATING BATH
Title (en)
MEASURING ADDITIVE CONCENTRATION IN AN ELECTROPLATING BATH
Title (de)
MESSUNG DES ZUSATZMITTELGEHALTES IN EINEM ELEKTROPLATTIERBAD
Title (fr)
MESURE DE LA CONCENTRATION D'UN ADDITIF DANS UN BAIN GALVANOPLASTIQUE
Publication
Application
Priority
- US 9909659 W 19990503
- US 8388298 P 19980501
Abstract (en)
[origin: WO9957549A1] A method for measuring a target constituent of an electroplating solution using an electroanalytical technique is set forth in which the electroplating solution includes one or more constituents whose by-products skew an initial electrical response to an energy input of the electroanalytical technique. The method comprises a first step in which an electroanalytical measurement cycle of the target constituent is initiated by providing an energy input to a pair of electrodes (10, 20) disposed in the electroplating solution. The energy input to the pair of electrodes is provided for at least a predetermined time period corresponding to a time period in which the electroanalytical measurement cycle reaches a steady-state condition. In a subsequent step, an electroanalytical measurement of the energy output of the electroanalytical technique is taken after the electroanalytical measurement cycle has reached the steady-state condition. The electroanalytical measurement is then used to determine an amount of the target constituent in the electroplating solution. An automatic dosing system (100) that includes the foregoing method and/or one or more known electroanalytical techniques in a close-loop system is also set forth.
IPC 1-7
IPC 8 full level
G01N 27/48 (2006.01); G01N 27/416 (2006.01)
CPC (source: EP KR)
G01N 27/26 (2013.01 - KR); G01N 27/4161 (2013.01 - EP)
Citation (search report)
See references of WO 9957549A1
Designated contracting state (EPC)
AT CH DE FR GB LI NL
DOCDB simple family (publication)
WO 9957549 A1 19991111; CN 1213295 C 20050803; CN 1266487 A 20000913; EP 0993606 A1 20000419; JP 2002506531 A 20020226; KR 20010014440 A 20010226
DOCDB simple family (application)
US 9909659 W 19990503; CN 99800656 A 19990503; EP 99921622 A 19990503; JP 55571099 A 19990503; KR 19997012635 A 19991231