EP 0995227 A1 20000426 - A CONTROLLED CLEAVAGE PROCESS
Title (en)
A CONTROLLED CLEAVAGE PROCESS
Title (de)
KONTROLLIERTES SPALTUNGSVERFAHREN
Title (fr)
PROCEDE DE CLIVAGE CONTROLE
Publication
Application
Priority
- US 9809567 W 19980511
- US 4627697 P 19970512
- US 2611598 A 19980219
- US 2602798 A 19980219
Abstract (en)
[origin: WO9852216A1] A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of introducing energetic particles (22) in a selected manner through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define a donor substrate material (12) above the selected depth and the particles for a pattern at the selected depth. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
IPC 1-7
IPC 8 full level
H01L 21/265 (2006.01); B26D 3/28 (2006.01); B26F 3/00 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/304 (2006.01); H01L 21/425 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01)
CPC (source: EP)
B26D 3/28 (2013.01); B26F 3/00 (2013.01); B26F 3/002 (2013.01); H01L 21/26506 (2013.01); H01L 21/76254 (2013.01); H01L 27/1203 (2013.01)
Designated contracting state (EPC)
DE FR GB IE IT NL
DOCDB simple family (publication)
WO 9852216 A1 19981119; AU 7685198 A 19981208; CA 2290104 A1 19981119; CN 1146973 C 20040421; CN 1255237 A 20000531; EP 0995227 A1 20000426; EP 0995227 A4 20000705; JP 2001525991 A 20011211
DOCDB simple family (application)
US 9809567 W 19980511; AU 7685198 A 19980511; CA 2290104 A 19980511; CN 98804976 A 19980511; EP 98924756 A 19980511; JP 54937198 A 19980511