Global Patent Index - EP 0995346 A1

EP 0995346 A1 2000-04-26 - A HEATING METHOD FOR A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD COMPRISING A HEATING ELEMENT

Title (en)

A HEATING METHOD FOR A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD COMPRISING A HEATING ELEMENT

Title (de)

HEIZVERFAHREN FÜR EINE LEITERPLATTE UND LEITERPLATTE MIT EINEN HEIZELEMENT

Title (fr)

PROCEDE DE CHAUFFAGE POUR UNE PLAQUETTE DE CIRCUIT IMPRIME ET PLAQUETTE CONTENANT UN ELEMENT CHAUFFANT

Publication

EP 0995346 A1 (EN)

Application

EP 99922215 A

Priority

  • FI 9900373 W
  • FI 981032 A

Abstract (en)

[origin: WO9959387A1] The present invention relates to a heating method and a printed circuit board comprising a heating element (90) which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor (40) between the heating element (90) and the component to be heated, the heat conductor receiving heat generated by the heating element (90) and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts (15, 70) which are narrower than the heat conductor (40), or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor (40) to a component other than the one to be heated when the heat conductor (40) functions as a ground plane or a signal path.

IPC 1-7 (main, further and additional classification)

H05K 7/20

IPC 8 full level (invention and additional information)

H05K 7/20 (2006.01); H01L 23/34 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01)

CPC (invention and additional information)

H05K 1/0212 (2013.01); H01L 23/345 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3494 (2013.01); H05K 3/429 (2013.01); H05K 2201/062 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09772 (2013.01); H05K 2201/09781 (2013.01)

Combination set (CPC)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 9959387A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9959387 A1 19991118; AU 3934599 A 19991129; CN 1269120 A 20001004; EP 0995346 A1 20000426; FI 981032 A0 19980508; FI 981032 A 19991109; JP 2002515654 A 20020528; NO 20000081 A 20000107; NO 20000081 D0 20000107; US 6184494 B1 20010206

INPADOC legal status


2005-03-09 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20040903

2004-06-09 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20040422

2002-03-13 [RAP1] TRANSFER OF RIGHTS OF AN EP PUBLISHED APPLICATION

- Owner name: NOKIA CORPORATION

- Ref Legal Event Code: RAP1

2000-04-26 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000106

2000-04-26 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE