EP 0995808 A4 20060412 - COPPER ALLOY AND COPPER ALLOY THIN SHEET EXHIBITING IMPROVED WEAR OF BLANKING METAL MOLD
Title (en)
COPPER ALLOY AND COPPER ALLOY THIN SHEET EXHIBITING IMPROVED WEAR OF BLANKING METAL MOLD
Title (de)
KUPFER-LEGIERUNG UND DARAUS BESTEHENDES DÜNNES BLECH MIT VERBESSERTEM VERSCHLEISS FÜR EINE ROHUMFORM-KOKILLE
Title (fr)
ALLIAGE DE CUIVRE ET FEUILLE MINCE EN ALLIAGE DE CUIVRE POSSEDANT UNE RESISTANCE A L'USURE AMELIOREE EN TANT QUE MOULE METALLIQUE D'ESTAMPAGE
Publication
Application
Priority
- JP 9901116 W 19990309
- JP 5798998 A 19980310
- JP 15454598 A 19980603
- JP 4432299 A 19990223
Abstract (en)
[origin: EP0995808A1] A copper-based alloy having excellent blanking die wear resistance, repeated bending fatigue resistance, and solderability as well as excellent resin adhesion, comprising 1.5 to 2.4 weight % of Fe, 0.008 to 0.08 weight % of P, 0.01 to 0.50 weight % of Zn, and 0.0005 to 0.02 weight % of C, and, if required, further containing 0.003 to 0.5 weight % of Ni and 0.003 to 0.5 weight % of Sn, and further containing a total amount of 0.0007 to 0.5 weight % of one or two or more elements selected from the group consisting of Al, Be, Ca, Cr, Mg and Si, and the balance being Cu and inevitable impurities, in which the total content of one or two or more elements selected from the group consisting of Nb, Ti, Zr, Ta, Hf, W, V and Mo is limited to less than 0.01 weight %.
IPC 1-7
IPC 8 full level
C22C 9/00 (2006.01); C22C 9/04 (2006.01); C22C 9/06 (2006.01); C22C 9/10 (2006.01)
CPC (source: EP KR)
C22C 9/00 (2013.01 - EP KR)
Citation (search report)
- [A] US 4668471 A 19870526 - FUTATSUKA RENSEI [JP], et al
- [A] US 3522038 A 19700728 - MCLAIN CHARLES D
- [A] US 3522039 A 19700728 - MCLAIN CHARLES D
- [A] EP 0384260 A1 19900829 - MITSUBISHI SHINDO KK [JP]
- [A] EP 0767244 A1 19970409 - MITSUBISHI SHINDO KK [JP]
- [A] GB 1180893 A 19700211 - OLIN MATHIESON [US]
- [A] US 4749548 A 19880607 - AKUTSU HIDETOSHI [JP], et al
- [XA] PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30)
- [Y] PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09)
- [Y] PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09)
- [Y] PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09)
- [Y] PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31)
- [A] PATENT ABSTRACTS OF JAPAN vol. 016, no. 219 (C - 0943) 22 May 1992 (1992-05-22)
- See references of WO 9946415A1
Designated contracting state (EPC)
FR IT
DOCDB simple family (publication)
EP 0995808 A1 20000426; EP 0995808 A4 20060412; EP 0995808 B1 20090826; CN 1102177 C 20030226; CN 1256715 A 20000614; DE 19980583 T1 20000413; HK 1028425 A1 20010216; KR 100562790 B1 20060321; KR 20010012450 A 20010215; TW 442576 B 20010623; WO 9946415 A1 19990916
DOCDB simple family (application)
EP 99939202 A 19990309; CN 99800259 A 19990309; DE 19980583 T 19990309; HK 00107927 A 20001209; JP 9901116 W 19990309; KR 19997010404 A 19991110; TW 88103623 A 19990309