Global patent index - EP 0996968 A1

EP 0996968 A1 2000-05-03 - METHOD AND DEVICE FOR TREATING TWO-DIMENSIONAL SUBSTRATES, ESPECIALLY SILICON SLICES (WAFERS), FOR PRODUCING MICROELECTRONIC COMPONENTS

Title (en)

METHOD AND DEVICE FOR TREATING TWO-DIMENSIONAL SUBSTRATES, ESPECIALLY SILICON SLICES (WAFERS), FOR PRODUCING MICROELECTRONIC COMPONENTS

Title (de)

VERFAHREN UND VORRICHTUNG ZUM BEHANDELN VON FLÄCHIGEN SUBSTRATEN, INSBESONDERE SILIZIUM-SCHEIBEN (WAFER) ZUR HERSTELLUNG MIKROELEKTRONISCHER BAUELEMENTE

Title (fr)

PROCEDE ET DISPOSITIF POUR LE TRAITEMENT DE SUBSTRATS PLANS, EN PARTICULIER DE PASTILLES DE SILICIUM (TRANCHES) POUR LA FABRICATION DE COMPOSANTS MICROELECTRONIQUES

Publication

EP 0996968 A1 (DE)

Application

EP 98939590 A

Priority

  • DE 19730582 A
  • DE 19730581 A
  • EP 9804049 W

Abstract (en)

[origin: US6251551B1] The invention concerns a method and a device for treating and processing flat substrates such as silicon slices (wafers) for producing microelectronic components in vertical alignment.

IPC 1-7 (main, further and additional classification)

H01L 21/00

IPC 8 full level (invention and additional information)

G03F 7/20 (2006.01); H01L 21/00 (2006.01); H01L 21/027 (2006.01); H01L 21/304 (2006.01); H01L 21/677 (2006.01)

CPC (invention and additional information)

H01L 21/67173 (2013.01); G03F 7/20 (2013.01); G03F 7/7075 (2013.01); H01L 21/67028 (2013.01); H01L 21/67225 (2013.01); H01L 21/67706 (2013.01); H01L 21/67712 (2013.01); H01L 21/67715 (2013.01); H01L 21/67736 (2013.01)

Citation (search report)

See references of WO 9904416A1

Designated contracting state (EPC)

DE FR GB NL

EPO simple patent family

US 6251551 B1 20010626; EP 0996968 A1 20000503; JP 2001510940 A 20010807; WO 9904416 A1 19990128

INPADOC legal status

2004-08-04 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20040202

2000-05-03 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 19991211

2000-05-03 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB NL