Global patent index - EP 0996977 A1

EP 0996977 A1 2000-05-03 - ELECTRICAL BONDING OF A SEMICONDUCTOR JUNCTION

Title (en)

ELECTRICAL BONDING OF A SEMICONDUCTOR JUNCTION

Title (de)

KONTAKTIERUNG EINER HALBLEITERZONE

Title (fr)

METALLISATION D'UNE JONCTION SEMI-CONDUCTRICE

Publication

EP 0996977 A1 (DE)

Application

EP 98944992 A

Priority

  • DE 9801987 W
  • DE 19730327 A

Abstract (en)

[origin: WO9904427A1] The invention concerns a method for the electrical bonding of semiconductor components, and a corresponding semiconductor component obtained by said method. A method is disclosed for bonding a buried semiconductor coat (1), via a feedthrough (4) Said method consists in producing the feedthrough (4) in an insulating layer (2) for the electrical bonding of at least one buried semiconductor coat (1), and is characterised in that it comprises steps consisting in: producing a highly doped polysilicon layer (7) on the insulating layer surface (2), the feedthrough (4) being filled at least partially with highly doped polysilicon, and in applying a metal coating (3) on said highly doped polysilicon layer (7) to produce ohmic contact outwards.

IPC 1-7 (main, further and additional classification)

H01L 21/768

IPC 8 full level (invention and additional information)

H01L 21/28 (2006.01); H01L 21/336 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 29/78 (2006.01)

CPC (invention and additional information)

H01L 21/76877 (2013.01); H01L 2924/0002 (2013.01)

Combination set (CPC)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 9904427A1

Designated contracting state (EPC)

DE FR GB IE IT

EPO simple patent family

WO 9904427 A1 19990128; EP 0996977 A1 20000503; JP 2001510942 A 20010807; US 6281119 B1 20010828

INPADOC legal status

2006-04-19 [18R] REFUSED

- Ref Legal Event Code: 18R

- Effective date: 20051125

2003-07-16 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20030603

2000-05-03 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000105

2000-05-03 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB IE IT