EP 0999057 A3 20001129 - Method for forming thick film layer of micro injecting device
Title (en)
Method for forming thick film layer of micro injecting device
Title (de)
Verfahren zum Bilden einer Dickfilmschicht für Mikrospritzvorrichtung
Title (fr)
Procédé de formation d'une couche à film épais pour micro-dispositif d'injection
Publication
Application
Priority
RU 98119888 A 19981103
Abstract (en)
[origin: EP0999057A2] A method for forming at thick film layer (30) of micro injecting device is disclosed in which a thin film layer (31') is formed on a substrate (1), a thick film layer (32') is formed on the thin film layer (31') without performing additional heat-treatment, and the thin film layer (31') and thick film layer (32') formed sequentially on the substrate are simultaneously heat-treated, to thereby complete a single thick film layer (30). The single thick film layer (30) is formed by a sequential coating process without being interfered by heat-treatment, thereby eliminating an isolating line. As a result, an overall durability of thick film layer (30) can be significantly enhanced. <IMAGE>
IPC 1-7
IPC 8 full level
B41J 2/04 (2006.01); B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01)
CPC (source: EP KR)
B41J 2/04 (2013.01 - KR); B41J 2/14032 (2013.01 - EP); B41J 2/1603 (2013.01 - EP); B41J 2/1626 (2013.01 - EP); B41J 2/1645 (2013.01 - EP)
Citation (search report)
- [X] US 5450108 A 19950912 - DRAKE DONALD J [US], et al
- [A] US 5682187 A 19971028 - WATANABE TAKASHI [JP], et al
- [A] US 4267212 A 19810512 - SAKAWAKI SHINICHI
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 0999057 A2 20000510; EP 0999057 A3 20001129; CN 1253042 A 20000517; JP 2000141670 A 20000523; KR 20000034821 A 20000626; RU 2144472 C1 20000120
DOCDB simple family (application)
EP 99308721 A 19991103; CN 99126009 A 19991103; JP 31441099 A 19991104; KR 19990007326 A 19990305; RU 98119888 A 19981103