Global patent index - EP 0999057 A3

EP 0999057 A3 2000-11-29 - Method for forming thick film layer of micro injecting device

Title (en)

Method for forming thick film layer of micro injecting device

Title (de)

Verfahren zum Bilden einer Dickfilmschicht für Mikrospritzvorrichtung

Title (fr)

Procédé de formation d'une couche à film épais pour micro-dispositif d'injection

Publication

EP 0999057 A3 (EN)

Application

EP 99308721 A

Priority

RU 98119888 A

Abstract (en)

[origin: EP0999057A2] A method for forming at thick film layer (30) of micro injecting device is disclosed in which a thin film layer (31') is formed on a substrate (1), a thick film layer (32') is formed on the thin film layer (31') without performing additional heat-treatment, and the thin film layer (31') and thick film layer (32') formed sequentially on the substrate are simultaneously heat-treated, to thereby complete a single thick film layer (30). The single thick film layer (30) is formed by a sequential coating process without being interfered by heat-treatment, thereby eliminating an isolating line. As a result, an overall durability of thick film layer (30) can be significantly enhanced. <IMAGE>

IPC 1-7 (main, further and additional classification)

B41J 2/16

IPC 8 full level (invention and additional information)

B41J 2/04 (2006.01); B41J 2/05 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01)

CPC (invention and additional information)

B41J 2/1603 (2013.01); B41J 2/14032 (2013.01); B41J 2/1626 (2013.01); B41J 2/1645 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

EP 0999057 A2 20000510; EP 0999057 A3 20001129; CN 1253042 A 20000517; JP 2000141670 A 20000523; KR 20000034821 A 20000626; RU 2144472 C1 20000120

INPADOC legal status

2002-01-02 [18D] DEEMED TO BE WITHDRAWN

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- Effective date: 20010530

2001-08-16 [AKX] PAYMENT OF DESIGNATION FEES

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2000-05-10 [17P] REQUEST FOR EXAMINATION FILED

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- Effective date: 19991116

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