Title (en)

Semiconductor package

Title (de)

Halbleitergehäuse

Title (fr)

Boîtier pour sémi-conducteur

Publication

EP 0999591 A1 20000510 (EN)

Application

EP 99203657 A 19991104

Priority

US 10723498 P 19981105

Abstract (en)

The invention provides a low inductance semiconductor package for RF circuits having a flat leadframe with internal leads formed upward to be in very close proximity to the die mount pad. The die mount pad is exposed through the package backside and serves both as a ground plane and as a heat spreader. The external leads are flat and extend beyond the package edge so that solder connections to a printed wiring board can be made. <IMAGE>

IPC 1-7

H01L 23/495

IPC 8 full level

H01L 23/433 (2006.01); H01L 23/66 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01)

CPC (source: EP)

H01L 23/4334 (2013.01); H01L 23/66 (2013.01); H05K 3/341 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30111 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/10969 (2013.01); Y02P 70/50 (2015.11)

C-Set (source: EP)

1. H01L 2224/48091 + H01L 2924/00014
2. H01L 2224/49171 + H01L 2224/48247 + H01L 2924/00
3. H01L 2224/45144 + H01L 2924/00014
4. H01L 2924/10253 + H01L 2924/00
5. H01L 2224/45015 + H01L 2924/20752
6. H01L 2924/30111 + H01L 2924/00
7. H01L 2924/181 + H01L 2924/00012
8. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00012

Citation (applicant)

US 5594234 A 19970114 - CARTER JR BUFORD H [US], et al

Citation (search report)

• [PX] EP 0895287 A2 19990203 - MATSUSHITA ELECTRONICS CORP [JP]
• [Y] EP 0068539 A1 19830105 - MOTOROLA INC [US]
• [Y] EP 0548497 A1 19930630 - SGS THOMSON MICROELECTRONICS [IT]
• [A] EP 0047195 A2 19820310 - EFCIS [FR]
• [A] US 5731632 A 19980324 - KOZONO HIROYUKI [JP]
• [A] PATENT ABSTRACTS OF JAPAN vol. 012, no. 221 (E - 625) 23 June 1988 (1988-06-23)
• [A] PATENT ABSTRACTS OF JAPAN vol. 011, no. 119 (E - 499) 14 April 1987 (1987-04-14)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 0999591 A1 20000510

DOCDB simple family (application)

EP 99203657 A 19991104