EP 1000442 A4 20000517 - VIALESS INTEGRATED INDUCTIVE ELEMENTS FOR ELECTROMAGNETIC APPLICATIONS
Title (en)
VIALESS INTEGRATED INDUCTIVE ELEMENTS FOR ELECTROMAGNETIC APPLICATIONS
Title (de)
INDUKTIVE ELEMENTE FÜR ELEKTROMAGNETISCHE ANWENDUNGEN OHNE KONTAKTLÖCHER
Title (fr)
ELEMENTS INDUCTIFS INTEGRES SANS TROUS D'INTERCONNEXIONS POUR DES APPLICATIONS ELECTROMAGNETIQUES
Publication
Application
Priority
- US 9801879 W 19980130
- US 79433897 A 19970203
Abstract (en)
[origin: WO9834287A1] An inductor suitable for integration in VLSI circuits and devices is fabricated by means of a post foundry procedure involving the deposition and patterning of layers of conductor material (32), isolation material (34), core material (50), isolation material (52) and conductor material (54) to produce conductive coils (60, 62) wrapped around a magnetic core without the need for vias. The fabrication steps utilize a combination of microelectronic and micromachining technologies.
IPC 1-7
IPC 8 full level
H01F 17/00 (2006.01); H01L 21/822 (2006.01); H01L 27/04 (2006.01)
CPC (source: EP KR)
H01F 17/0033 (2013.01 - EP); H10N 50/80 (2023.02 - KR)
Citation (search report)
- [A] US 3881244 A 19750506 - KENDALL DON LESLIE
- [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 568 (E - 1447) 14 October 1993 (1993-10-14)
- See references of WO 9834287A1
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
WO 9834287 A1 19980806; AU 6052498 A 19980825; CA 2279297 A1 19980806; EP 1000442 A1 20000517; EP 1000442 A4 20000517; JP 2002513511 A 20020508; KR 20000070732 A 20001125; TW 362287 B 19990621
DOCDB simple family (application)
US 9801879 W 19980130; AU 6052498 A 19980130; CA 2279297 A 19980130; EP 98903872 A 19980130; JP 53314298 A 19980130; KR 19997006982 A 19990803; TW 87101261 A 19980203