Global Patent Index - EP 1000442 A4

EP 1000442 A4 20000517 - VIALESS INTEGRATED INDUCTIVE ELEMENTS FOR ELECTROMAGNETIC APPLICATIONS

Title (en)

VIALESS INTEGRATED INDUCTIVE ELEMENTS FOR ELECTROMAGNETIC APPLICATIONS

Title (de)

INDUKTIVE ELEMENTE FÜR ELEKTROMAGNETISCHE ANWENDUNGEN OHNE KONTAKTLÖCHER

Title (fr)

ELEMENTS INDUCTIFS INTEGRES SANS TROUS D'INTERCONNEXIONS POUR DES APPLICATIONS ELECTROMAGNETIQUES

Publication

EP 1000442 A4 (EN)

Application

EP 98903872 A

Priority

  • US 9801879 W
  • US 79433897 A

Abstract (en)

[origin: WO9834287A1] An inductor suitable for integration in VLSI circuits and devices is fabricated by means of a post foundry procedure involving the deposition and patterning of layers of conductor material (32), isolation material (34), core material (50), isolation material (52) and conductor material (54) to produce conductive coils (60, 62) wrapped around a magnetic core without the need for vias. The fabrication steps utilize a combination of microelectronic and micromachining technologies.

IPC 1-7

H01L 43/02; H01F 17/00; H01F 41/04; H01L 23/64

IPC 8 full level

H01F 17/00 (2006.01); H01L 21/822 (2006.01); H01L 27/04 (2006.01)

CPC (source: EP)

H01F 17/0033 (2013.01)

Citation (search report)

  • [A] US 3881244 A 19750506 - KENDALL DON LESLIE
  • [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 568 (E - 1447) 14 October 1993 (1993-10-14)
  • See also references of WO 9834287A1

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

WO 9834287 A1 19980806; AU 6052498 A 19980825; CA 2279297 A1 19980806; EP 1000442 A1 20000517; EP 1000442 A4 20000517; JP 2002513511 A 20020508; KR 20000070732 A 20001125; TW 362287 B 19990621

DOCDB simple family (application)

US 9801879 W 19980130; AU 6052498 A 19980130; CA 2279297 A 19980130; EP 98903872 A 19980130; JP 53314298 A 19980130; KR 19997006982 A 19990803; TW 87101261 A 19980203