EP 1002337 A1 20000524 - SEMICONDUCTOR CHIP PACKAGING AND METHOD FOR THE PRODUCTION THEREOF
Title (en)
SEMICONDUCTOR CHIP PACKAGING AND METHOD FOR THE PRODUCTION THEREOF
Title (de)
HALBLEITERCHIPPACKUNGEN UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
BOITIERS DE PUCES DE SEMICONDUCTEUR ET LEUR PROCEDE DE PRODUCTION
Publication
Application
Priority
- CH 9800318 W 19980723
- CH 178697 A 19970724
Abstract (en)
[origin: WO9905721A1] The invention relates to a method for producing semiconductor chip packaging using semiconductor chips (1). At least one semiconductor chip (1) is provided with at least one dielectric film (2, 2', 22). At least one opening is made in the at least one film (2, 2', 22). Current paths (40, 42, 30000, 30002) are placed on the at least one film (2, 2', 22) and in the at least one opening in such a way that at least one semiconductor chip connection (1.2) comes into electrical contact with the current paths (40, 42, 3000, 3002) by means of at least one opening.
IPC 1-7
IPC 8 full level
H01L 23/31 (2006.01); H01L 23/485 (2006.01)
CPC (source: EP)
H01L 23/31 (2013.01); H01L 23/3114 (2013.01); H01L 23/485 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01)
Citation (search report)
See references of WO 9905721A1
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
WO 9905721 A1 19990204; CA 2296333 A1 19990204; EP 1002337 A1 20000524
DOCDB simple family (application)
CH 9800318 W 19980723; CA 2296333 A 19980723; EP 98931882 A 19980723