Global Patent Index - EP 1002337 A1

EP 1002337 A1 2000-05-24 - SEMICONDUCTOR CHIP PACKAGING AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

SEMICONDUCTOR CHIP PACKAGING AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

HALBLEITERCHIPPACKUNGEN UND VERFAHREN ZU DEREN HERSTELLUNG

Title (fr)

BOITIERS DE PUCES DE SEMICONDUCTEUR ET LEUR PROCEDE DE PRODUCTION

Publication

EP 1002337 A1 (DE)

Application

EP 98931882 A

Priority

  • CH 9800318 W
  • CH 178697 A

Abstract (en)

[origin: WO9905721A1] The invention relates to a method for producing semiconductor chip packaging using semiconductor chips (1). At least one semiconductor chip (1) is provided with at least one dielectric film (2, 2', 22). At least one opening is made in the at least one film (2, 2', 22). Current paths (40, 42, 30000, 30002) are placed on the at least one film (2, 2', 22) and in the at least one opening in such a way that at least one semiconductor chip connection (1.2) comes into electrical contact with the current paths (40, 42, 3000, 3002) by means of at least one opening.

IPC 1-7 (main, further and additional classification)

H01L 23/31; H01L 23/485

IPC 8 full level (invention and additional information)

H01L 23/31 (2006.01); H01L 23/485 (2006.01)

CPC (invention and additional information)

H01L 23/31 (2013.01); H01L 23/3114 (2013.01); H01L 23/485 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01)

Citation (search report)

See references of WO 9905721A1

Designated contracting state (EPC)

DE GB

EPO simple patent family

WO 9905721 A1 19990204; CA 2296333 A1 19990204; EP 1002337 A1 20000524

INPADOC legal status


2003-08-13 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20030201

2000-05-24 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000125

2000-05-24 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE GB