Global patent index - EP 1002338 A1

EP 1002338 A1 2000-05-24 - WAFER MARKING

Title (en)

WAFER MARKING

Title (de)

WAFERMARKIERUNG

Title (fr)

MARQUAGE DE GALETTES

Publication

EP 1002338 A1 (DE)

Application

EP 98948693 A

Priority

  • DE 9802187 W
  • DE 19733410 A

Abstract (en)

[origin: DE19733410A1] A wafer marking is constituted by a plurality of soft marks produced in the surface of a wafer. These soft marks are at least 4 mu m deep, have an inner diameter of at least 50 mu m and in a particularly advantageous manner have a minimum rise at their surface of 0.2. These recesses (12) can be produced by means of a corresponding technology with depths of up to 6 mu m.

IPC 1-7 (main, further and additional classification)

H01L 23/544

IPC 8 full level (invention and additional information)

H01L 21/02 (2006.01); H01L 23/544 (2006.01); H01L 29/30 (2006.01)

CPC (invention and additional information)

H01L 23/544 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54473 (2013.01); H01L 2924/0002 (2013.01)

Combination set (CPC)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 9907016A1

Designated contracting state (EPC)

DE FR GB IE IT

EPO simple patent family

DE 19733410 A1 19990218; EP 1002338 A1 20000524; JP 2001512293 A 20010821; US 6261382 B1 20010717; WO 9907016 A1 19990211

INPADOC legal status

2002-10-23 [18W] WITHDRAWN

- Ref Legal Event Code: 18W

- Date of withdrawal: 20020828

2001-11-21 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20011009

2000-05-24 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000121

2000-05-24 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB IE IT