Global Patent Index - EP 1003789 A1

EP 1003789 A1 20000531 - RESIN COMPOSITION WITH IMPROVED RADIATION CURABILITY

Title (en)

RESIN COMPOSITION WITH IMPROVED RADIATION CURABILITY

Title (de)

HARZZUSAMMENSETZUNG MIT EINER VERBESSERTEN STRAHLUNGSHÄRTBARKEIT

Title (fr)

COMPOSITION A BASE DE RESINE, A DURCISSEMENT AMELIORE PAR EXPOSITION A UN RAYONNEMENT

Publication

EP 1003789 A1 20000531 (EN)

Application

EP 98937870 A 19980730

Priority

  • NL 9800439 W 19980730
  • NL 1006761 A 19970811

Abstract (en)

[origin: WO9907746A1] The invention relates to a radiation-curable resin composition containing at least a radiation-curable resin, a photo-excitable compound and an aliphatic amine, as amine a compound being chosen that has at least one tertiary amino group, at least one substituent of the tertiary amino group being an aliphatic chain that contains at least one electron-withdrawing group. Such a resin composition can be cured at a conversion that is superior to the conversion achieved according to the state of the art. In addition, the resin composition according to the invention can be cured at an accelerated curing rate, which exceeds or at least equals the curing rate of the resin composition according to the state of the art. Preferably the amine is a branched or star-shaped dendrimer that contains at least one tertiary amino group and in which an electron-withdrawing group is linked via an alkyl chain to the nitrogen atom of the tertiary amino group. Examples of suitable dendrimers are nitrile and ester-terminated polypropylene imine dendrimers.

IPC 1-7

C08F 2/50; C08G 83/00

IPC 8 full level

C08F 2/50 (2006.01); C08G 83/00 (2006.01); C08L 101/00 (2006.01)

CPC (source: EP KR)

C08F 2/50 (2013.01 - EP KR); C08L 101/005 (2013.01 - EP KR)

Citation (search report)

See references of WO 9907746A1

Designated contracting state (EPC)

BE CH DE ES FI FR GB IT LI NL SE

DOCDB simple family (publication)

WO 9907746 A1 19990218; AU 8651398 A 19990301; BR 9811894 A 20000822; CA 2300301 A1 19990218; CN 1274364 A 20001122; EP 1003789 A1 20000531; JP 2001512751 A 20010828; KR 20010022660 A 20010326; NL 1006761 C2 19990212

DOCDB simple family (application)

NL 9800439 W 19980730; AU 8651398 A 19980730; BR 9811894 A 19980730; CA 2300301 A 19980730; CN 98809930 A 19980730; EP 98937870 A 19980730; JP 2000506244 A 19980730; KR 20007001255 A 20000207; NL 1006761 A 19970811