EP 1004225 A1 20000531 - METHOD OF RADIATION HEATING SUBSTRATES AND APPLYING EXTRUDED MATERIAL
Title (en)
METHOD OF RADIATION HEATING SUBSTRATES AND APPLYING EXTRUDED MATERIAL
Title (de)
VERFAHREN ZUM STRAHLUNGSBEHEIZUNG EINES SUBSTRATS UND ZUM AUFTRAGEN EINES EXTRUSIONSMATERIAL
Title (fr)
PROCEDE DE CHAUFFAGE DE SUBSTRATS PAR RAYONNEMENT ET D'APPLICATION DE MATERIAU EXTRUDE
Publication
Application
Priority
- US 9707773 W 19970506
- US 1690596 P 19960506
Abstract (en)
[origin: WO9742793A1] A method for applying extrudable material (26) from nozzle (28) to substrate (32), in which concentrated light beam (30) as from lamp (22) is directed onto the substrate before or after application of the extrudable material. The beam energy is concentrated by mirror (24) on the substrate surface. It is subsequently transferred to the deposited extrudable material, thereby increasing the temperature and lowering the viscosity of the closely situated material, facilitating material penetration into the substrate. This allows use of illumination of modest energy density and of wavelengths not absorbed by the extrudable material. When the extrudable material is an adhesive and is applied to a plurality of substrates, of which at least one is treated with a light beam according to this method, and the extrudable materials adhered to the substrates are brought into contact, joining of the extrudable materials creates a strong bond between the substrates. The invention includes articles made by the method.
IPC 1-7
H05B 6/02; H05B 6/46; H05B 6/64; B05D 3/06; B05D 5/10; B32B 27/04; B32B 27/34
IPC 8 full level
B05D 3/06 (2006.01); B32B 7/04 (2006.01); B32B 27/34 (2006.01); B32B 38/00 (2006.01); H05B 3/00 (2006.01); B32B 37/15 (2006.01)
CPC (source: EP)
B05D 3/06 (2013.01); B32B 7/04 (2013.01); B32B 27/34 (2013.01); B32B 38/0036 (2013.01); H05B 3/0042 (2013.01); H05B 3/0047 (2013.01); B32B 37/153 (2013.01); B32B 2310/0806 (2013.01); B32B 2310/0843 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 9742793 A1 19971113; AU 3118797 A 19971126; EP 1004225 A1 20000531; EP 1004225 A4 20001011
DOCDB simple family (application)
US 9707773 W 19970506; AU 3118797 A 19970506; EP 97926416 A 19970506