EP 1004227 A1 20000531 - INTERMEDIATE LAYER TO IMPROVE PEEL STRENGTH OF COPPER FOILS
Title (en)
INTERMEDIATE LAYER TO IMPROVE PEEL STRENGTH OF COPPER FOILS
Title (de)
ZWISCHENLAGE ZUR VERBESSERUNG DER ABZIEHFESTIGKEIT VON KUPFERFOLIEN
Title (fr)
COUCHE INTERMEDIAIRE POUR AMELIORER LA RESISTANCE AU PELAGE DE FEUILLES DE CUIVRE
Publication
Application
Priority
- US 9909551 W 19990429
- US 7124498 A 19980501
Abstract (en)
[origin: WO9957949A1] A method is disclosed for providing an improved adherence, or peel strength, between copper foil and a circuit board laminate having low dielectric and high glass transition temperature, through the use of an intermediate organic resin compound. Epoxy and phenoxy resins having average molecular weight in excess of 4500 are preferred to achieve necessary increases in peel strength for low dielectric circuit board laminate materials.
IPC 1-7
IPC 8 full level
B32B 15/20 (2006.01); H05K 3/38 (2006.01)
CPC (source: EP)
B32B 15/20 (2013.01); H05K 3/386 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/0759 (2013.01)
Citation (search report)
See references of WO 9957949A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9957949 A1 19991111; CA 2298684 A1 19991111; EP 1004227 A1 20000531; TW 486430 B 20020511
DOCDB simple family (application)
US 9909551 W 19990429; CA 2298684 A 19990429; EP 99920252 A 19990429; TW 88107038 A 19990510