Global Patent Index - EP 1004227 A1

EP 1004227 A1 2000-05-31 - INTERMEDIATE LAYER TO IMPROVE PEEL STRENGTH OF COPPER FOILS

Title (en)

INTERMEDIATE LAYER TO IMPROVE PEEL STRENGTH OF COPPER FOILS

Title (de)

ZWISCHENLAGE ZUR VERBESSERUNG DER ABZIEHFESTIGKEIT VON KUPFERFOLIEN

Title (fr)

COUCHE INTERMEDIAIRE POUR AMELIORER LA RESISTANCE AU PELAGE DE FEUILLES DE CUIVRE

Publication

EP 1004227 A1 (EN)

Application

EP 99920252 A

Priority

  • US 9909551 W
  • US 7124498 A

Abstract (en)

[origin: WO9957949A1] A method is disclosed for providing an improved adherence, or peel strength, between copper foil and a circuit board laminate having low dielectric and high glass transition temperature, through the use of an intermediate organic resin compound. Epoxy and phenoxy resins having average molecular weight in excess of 4500 are preferred to achieve necessary increases in peel strength for low dielectric circuit board laminate materials.

IPC 1-7 (main, further and additional classification)

H05K 3/38

IPC 8 full level (invention and additional information)

B32B 15/20 (2006.01); H05K 3/38 (2006.01)

CPC (invention and additional information)

B32B 15/20 (2013.01); H05K 3/386 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); H05K 2203/0759 (2013.01)

Citation (search report)

See references of WO 9957949A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9957949 A1 19991111; CA 2298684 A1 19991111; EP 1004227 A1 20000531; TW 486430 B 20020511

INPADOC legal status


2001-07-11 [18W] WITHDRAWN

- Date of withdrawal: 20010514

2000-05-31 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000131

2000-05-31 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE