EP 1004400 A1 20000531 - Method for polishing a notch of a wafer
Title (en)
Method for polishing a notch of a wafer
Title (de)
Verfahren zum Polieren der Einschittteil einer Halbleiterscheibe
Title (fr)
Procédé de polissage pour l'encoche d'une plaquette semi-conductrice
Publication
Application
Priority
JP 33770098 A 19981127
Abstract (en)
A method for notch polishing by a notch-polishing unit (20) of an edge polisher is provided, in which evenness of polishing can be ensured by rotating a pad (32) for notch polishing in positive and reverse directions to polish a notch in a wafer (W). When the notch is polished by the pad (32) for notch polishing in the notch-polishing unit (20) formed of a sucking portion (30) for sucking a wafer (W) placed on the top surface thereof and the pad (32) for notch polishing rotatable by a driving source (33), the notch is evenly polished by rotating the pad (32) for notch polishing in positive and reverse directions. <IMAGE>
IPC 1-7
IPC 8 full level
B24B 19/02 (2006.01); B24B 9/00 (2006.01); B24B 9/06 (2006.01)
CPC (source: EP KR)
B24B 9/00 (2013.01 - KR); B24B 9/065 (2013.01 - EP); B24B 37/345 (2013.01 - EP)
Citation (search report)
- [Y] EP 0764976 A1 19970326 - SHINETSU HANDOTAI KK [JP]
- [Y] EP 0629470 A1 19941221 - SHINETSU HANDOTAI KK [JP], et al
- [A] DE 4325518 A1 19950202 - WACKER CHEMITRONIC [DE]
- [A] EP 0633097 A1 19950111 - SHINETSU HANDOTAI KK [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1004400 A1 20000531; JP 2000158315 A 20000613; KR 20000047734 A 20000725; TW 415880 B 20001221
DOCDB simple family (application)
EP 99122257 A 19991108; JP 33770098 A 19981127; KR 19990052942 A 19991126; TW 88119490 A 19991108