Global Patent Index - EP 1006756 A1

EP 1006756 A1 2000-06-07 - Sensor controlled hot plate with sensor arranged below the plate

Title (en)

Sensor controlled hot plate with sensor arranged below the plate

Title (de)

Sensorgesteuertes Kochfeld mit unterhalb der Kochfeldplatte angeordneter Sensoreinheit

Title (fr)

Régulateur de plaque chauffante à l'aide d'un détecteur situé en dessous de la plaque

Publication

EP 1006756 A1 (DE)

Application

EP 99123600 A

Priority

DE 19856140 A

Abstract (en)

The value of the transmission of a cooking plate (3) in a spectral measurement aperture (18) towards the infrared (IR) radiation sensor (19) is smaller than 10% approaching 0%. A reflection-layer (17) is deposited on wall of a measurement hole (15) to increase of sensitivity the measurement. Under a cooking plate (3), a measurement aperture (18) passes the heat radiation towards the IR sensor (19).

Abstract (de)

Bekannt ist ein sensorgesteuertes Kochfeld mit einer Kochfeldplatte, insbesondere aus Glaskeramik, mit zumindest einer Kochzone, die mittels eines unterhalb der Kochfeldplatte angeordneten Heizelementes beheizbar ist, sowie mit einer unterhalb der Kochfeldplatte angeordneten und gegen deren Unterseite im Bereich eines flächenmäßig begrenzten Meßfleckes gerichteten Wärmestrahlungs-Sensoreinheit, die in Verbindung steht mit einer Steuereinheit zur Regelung der Heizleistung des Heizelementes. Um topfunabhängig eine möglichst genaue Heizleistungsregelung zu erreichen, ist erfindungsgemäß vorgesehen, daß der Wert des Transmissionsgrades des Materials der Kochfeldplatte zumindest im Bereich des Meßfleckes zumindest im spektralen Meßbereich der Wärmestrahlungs-Sensoreinheit kleiner als 30 %, vorzugsweise kleiner als 10 % und insbesondere annähernd etwa 0 % ist. <IMAGE>

IPC 1-7 (main, further and additional classification)

H05B 6/06; G02B 6/00; H05B 1/02; H05B 3/00; H05B 3/68; H05B 6/08; H05B 6/12

IPC 8 full level (invention and additional information)

H05B 3/74 (2006.01)

CPC (invention and additional information)

H05B 3/746 (2013.01); H05B 2213/07 (2013.01)

Citation (search report)

Designated contracting state (EPC)

DE ES FR GB IT SE

EPO simple patent family

EP 1006756 A1 20000607; EP 1006756 B1 20020605; EP 1006756 B2 20100217; DE 19856140 A1 20000608; ES 2178337 T3 20021216; ES 2178337 T5 20100531; US 6225607 B1 20010501

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