Global patent index - EP 1008103 A1

EP 1008103 A1 2000-06-14 - METHOD FOR MANUFACTURING A CHIP CARD

Title (en)

METHOD FOR MANUFACTURING A CHIP CARD

Title (de)

VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE

Title (fr)

MODE DE FABRICATION D'UNE CARTE A PUCE

Publication

EP 1008103 A1 (DE)

Application

EP 97952785 A

Priority

  • DE 19647846 A
  • EP 9706469 W

Abstract (en)

[origin: DE19647846C1] In the method, a semiconductor chip module is inserted in a recess (2) in the surface of the card carrier (1), in electrical contact with an inductive signal transmission device provided by an antenna coil (3). The antenna coil, or its end terminations (4) are located within the recess for the semiconductor chip module and wound in a spiral for absorbing the flexure and/or torsion forces in the vicinity of the semiconductor chip module connections.

IPC 1-7 (main, further and additional classification)

G06K 19/077

IPC 8 full level (invention and additional information)

G06K 19/077 (2006.01)

CPC (invention and additional information)

G06K 19/0775 (2013.01); G06K 19/07749 (2013.01); G06K 19/07779 (2013.01); G06K 19/07783 (2013.01)

Citation (search report)

See references of WO 9822906A1

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

DE 19647846 C1 19980312; AU 5654198 A 19980610; EP 1008103 A1 20000614; WO 9822906 A1 19980528

INPADOC legal status

2004-10-06 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20040325

2004-01-02 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20031114

2000-06-14 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 19990504

2000-06-14 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE