EP 1008103 A1 20000614 - METHOD FOR MANUFACTURING A CHIP CARD
Title (en)
METHOD FOR MANUFACTURING A CHIP CARD
Title (de)
VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE
Title (fr)
MODE DE FABRICATION D'UNE CARTE A PUCE
Publication
Application
Priority
- DE 19647846 A 19961119
- EP 9706469 W 19971119
Abstract (en)
[origin: DE19647846C1] In the method, a semiconductor chip module is inserted in a recess (2) in the surface of the card carrier (1), in electrical contact with an inductive signal transmission device provided by an antenna coil (3). The antenna coil, or its end terminations (4) are located within the recess for the semiconductor chip module and wound in a spiral for absorbing the flexure and/or torsion forces in the vicinity of the semiconductor chip module connections.
IPC 1-7
IPC 8 full level
G06K 19/077 (2006.01)
CPC (source: EP)
G06K 19/07749 (2013.01); G06K 19/0775 (2013.01); G06K 19/07779 (2013.01); G06K 19/07783 (2013.01)
Citation (search report)
See references of WO 9822906A1
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19647846 C1 19980312; AU 5654198 A 19980610; EP 1008103 A1 20000614; WO 9822906 A1 19980528
DOCDB simple family (application)
DE 19647846 A 19961119; AU 5654198 A 19971119; EP 9706469 W 19971119; EP 97952785 A 19971119