EP 1009025 A2 20000614 - Epoxy resin composition for encapsulation of semiconductor devices
Title (en)
Epoxy resin composition for encapsulation of semiconductor devices
Title (de)
Epoxyharzmasse zum Einkapseln von Halbleiterelementen
Title (fr)
Composition de résine époxy pour encapsulation de dispositifs semi-conducteurs
Publication
Application
Priority
- JP 34911298 A 19981208
- JP 24852399 A 19990902
Abstract (en)
An epoxy resin composition for semiconductor encpsulation, which is excellent in both storage stability and rapid curability, is disclosed. The epoxy resin composition for semiconductor encapsultion comprises (A) an epoxy resin, (B) a phenolic resin, and a combination of (C) a cure accelerator and (D) cure accelerator-containing microcapsules having a core/shell structure in which a cure accelerator as a core is encapsulated in a thermoplastic resin shell.
IPC 1-7
IPC 8 full level
C08G 59/18 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP KR US)
C08G 59/188 (2013.01 - EP US); H01L 21/56 (2013.01 - KR); H01L 23/293 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H01L 2924/12044 (2013.01 - EP US); Y10T 428/12528 (2015.01 - EP US)
Designated contracting state (EPC)
BE DE FR GB
DOCDB simple family (publication)
EP 1009025 A2 20000614; EP 1009025 A3 20020828; CN 1238421 C 20060125; CN 1256288 A 20000614; JP 2000230039 A 20000822; KR 100581988 B1 20060523; KR 20000047506 A 20000725; MY 116439 A 20040131; TW 500759 B 20020901; US 6248454 B1 20010619
DOCDB simple family (application)
EP 99119397 A 19990929; CN 99125150 A 19990930; JP 24852399 A 19990902; KR 19990042243 A 19991001; MY PI9904225 A 19990930; TW 88116928 A 19991001; US 40969299 A 19990930