Global Patent Index - EP 1009569 A2

EP 1009569 A2 2000-06-21 - APPARATUS AND METHOD FOR SLICING A WORKPIECE UTILIZING A DIAMOND IMPREGNATED WIRE

Title (en)

APPARATUS AND METHOD FOR SLICING A WORKPIECE UTILIZING A DIAMOND IMPREGNATED WIRE

Title (de)

VORRICHTUNG UND VERFAHREN ZUM SCHNEIDEN EINES WERKSTÜCKS MITTELS EINEM DIAMANTIERTEN SÄGEDRAHT

Title (fr)

APPAREIL ET PROCEDE DE DECOUPE EN TRANCHES D'UNE PIECE A TRAVAILLER AU MOYEN D'UN FIL DIAMANTE

Publication

EP 1009569 A2 (EN)

Application

EP 98933215 A

Priority

  • US 9814040 W
  • US 88895297 A
  • US 99307797 A
  • US 10886498 A

Abstract (en)

[origin: WO9902295A2] An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated, either continuously or reciprocally, about its longitudinal axis or the diamond wire saw is rotated, either reciprocally or continuously, about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece. When the relative rotation is continuous, the wire is advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). When the rotation is reciprocating, the wire is advanced from a position tangentially adjoining the outer diameter to a position through the workpiece. In both cases, the diamond wire cuts through the workpiece at a substantially tangential point to the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal "kerf" loss and less extensive follow-on lapping operations.

IPC 1-7 (main, further and additional classification)

B23D 1/00

IPC 8 full level (invention and additional information)

B24B 27/06 (2006.01); B28D 5/00 (2006.01); B28D 5/04 (2006.01)

CPC (invention and additional information)

B28D 5/0082 (2013.01); B28D 5/045 (2013.01)

Citation (search report)

See references of WO 9902295A3

Designated contracting state (EPC)

CH DE FR GB IT LI

EPO simple patent family

WO 9902295 A2 19990121; WO 9902295 A3 19991007; EP 1009569 A2 20000621; JP 2001510742 A 20010807

INPADOC legal status


2005-09-14 [18W] WITHDRAWN

- Effective date: 20050726

2000-06-21 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000207

2000-06-21 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): CH DE FR GB IT LI