EP 1009569 A2 20000621 - APPARATUS AND METHOD FOR SLICING A WORKPIECE UTILIZING A DIAMOND IMPREGNATED WIRE
Title (en)
APPARATUS AND METHOD FOR SLICING A WORKPIECE UTILIZING A DIAMOND IMPREGNATED WIRE
Title (de)
VORRICHTUNG UND VERFAHREN ZUM SCHNEIDEN EINES WERKSTÜCKS MITTELS EINEM DIAMANTIERTEN SÄGEDRAHT
Title (fr)
APPAREIL ET PROCEDE DE DECOUPE EN TRANCHES D'UNE PIECE A TRAVAILLER AU MOYEN D'UN FIL DIAMANTE
Publication
Application
Priority
- US 9814040 W 19980706
- US 88895297 A 19970707
- US 99307797 A 19971218
- US 10886498 A 19980701
Abstract (en)
[origin: WO9902295A2] An apparatus and method for slicing a workpiece, in particular, a polysilicon or single crystal silicon ingot, utilizing a diamond impregnated wire saw in which either the workpiece (or ingot) is rotated, either continuously or reciprocally, about its longitudinal axis or the diamond wire saw is rotated, either reciprocally or continuously, about the longitudinal axis of the workpiece as the diamond wire is driven orthogonally to the longitudinal axis of the workpiece. When the relative rotation is continuous, the wire is advanced from a position tangentially adjoining the outer diameter ("OD") of the ingot to a position tangential to its center or inner diameter ("ID"). When the rotation is reciprocating, the wire is advanced from a position tangentially adjoining the outer diameter to a position through the workpiece. In both cases, the diamond wire cuts through the workpiece at a substantially tangential point to the cut instead of straight through up to the entire diameter of the piece and single crystal silicon ingots of 300 mm to 400 mm or more may be sliced into wafers relatively quickly, with minimal "kerf" loss and less extensive follow-on lapping operations.
IPC 1-7
IPC 8 full level
B24B 27/06 (2006.01); B28D 5/00 (2006.01); B28D 5/04 (2006.01)
CPC (source: EP KR)
B23D 31/00 (2013.01 - KR); B28D 5/0082 (2013.01 - EP); B28D 5/045 (2013.01 - EP)
Citation (search report)
See references of WO 9902295A2
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
WO 9902295 A2 19990121; WO 9902295 A3 19991007; EP 1009569 A2 20000621; JP 2001510742 A 20010807; KR 20010021539 A 20010315
DOCDB simple family (application)
US 9814040 W 19980706; EP 98933215 A 19980706; JP 2000501861 A 19980706; KR 20007000097 A 20000106