EP 1010473 A3 20030528 - Device and method for coating a even substrate
Title (en)
Device and method for coating a even substrate
Title (de)
Vorrichtung und Verfahren zum Beschichten eines ebenen Substrates
Title (fr)
Dispositif et procédé de revêtement d'un substrat plan
Publication
Application
Priority
CH 249698 A 19981217
Abstract (en)
[origin: EP1010473A2] The arrangement has a coating module (2) with a capillary column filled with a liquid coating medium and with an opening past which the surface to be coated is moved at a relatively small distance so that a coating is deposited onto the surface. The capillary column is open at the bottom and is filled with coating medium via a supply chamber (25,27). The substrate (23) is passed beneath the opening of the column with the surface (23a) to be coated facing upwards. An Independent claim is also included for a method of coating a flat substrate.
IPC 1-7
IPC 8 full level
B05C 5/02 (2006.01); B05C 9/02 (2006.01); B05C 11/10 (2006.01)
CPC (source: EP US)
B05C 5/0254 (2013.01 - EP US); B05C 9/02 (2013.01 - EP US); B05C 11/1013 (2013.01 - EP US); Y10S 118/04 (2013.01 - EP US)
Citation (search report)
- [XA] US 4735169 A 19880405 - CAWSTON JAMES D [US], et al
- [PX] US 5871585 A 19990216 - MOST RONALD W [US], et al
- [XA] EP 0761317 A1 19970312 - TORAY INDUSTRIES [JP]
- [A] US 5654041 A 19970805 - APPICH KARL [DE], et al
- [A] EP 0464238 A1 19920108 - EPICOR TECHNOLOGY INC [US]
- [A] US 4154194 A 19790515 - ENDLICH WILHELM [DE], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1010473 A2 20000621; EP 1010473 A3 20030528; EP 1010473 B1 20060712; CA 2292271 A1 20000617; CA 2292271 C 20080318; DE 59913661 D1 20060824; ES 2274611 T3 20070516; MX PA99011776 A 20050419; US 6383571 B1 20020507
DOCDB simple family (application)
EP 99811153 A 19991213; CA 2292271 A 19991216; DE 59913661 T 19991213; ES 99811153 T 19991213; MX 9911776 A 19991215; US 46658499 A 19991217