EP 1010833 A3 20001011 - Method and device for mounting elevated floor panels
Title (en)
Method and device for mounting elevated floor panels
Title (de)
Verfahren und Vorrichtung zur Montage von aufgeständerten Fussbodenplatten
Title (fr)
Procédé et dispositif pour le montage de panneaux de plancher surélevé
Publication
Application
Priority
DE 19858693 A 19981218
Abstract (en)
[origin: EP1010833A2] Supports (3) are placed on the supporting plane (4) and each support plate (5) of the supports is coated with an adhesive face so that each floor board (1) is placed with each one corner on an adhesive face until a quarter of the surface of the support plate (5) is covered by a corner of the floor board and a centre access hole (6) is left free in the support plate. The corner of the floor board is lifted by hand to the required incline and the spindle of the support is operated by a suitable tool through the access hole until with the correctly aligned floor board the foot of the support rests smooth on the supporting plane. The steps are repeated for each further corner. A further floor board plate (2) is placed on the support plates and the steps are repeated for all corners of the second floor board.
IPC 1-7
IPC 8 full level
E04F 15/024 (2006.01)
CPC (source: EP)
E04F 15/024 (2013.01); E04F 15/02476 (2013.01)
Citation (search report)
- [XAY] DE 4228601 A1 19930401 - TAISEI ELECTRONIC IND CO [JP]
- [YA] EP 0295905 A2 19881221 - FLOORING JACK CO LTD [GB]
- [YA] DE 19631880 A1 19980212 - SICOWA VERFAHRENSTECH [DE], et al
- [A] CH 675003 A5 19900815 - GUENTER FEURSTEIN, et al
- [A] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 02 28 February 1997 (1997-02-28)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1010833 A2 20000621; EP 1010833 A3 20001011; DE 19858693 A1 20000621
DOCDB simple family (application)
EP 99125211 A 19991217; DE 19858693 A 19981218