EP 1013363 A1 20000628 - Apparatus for die casting material having a high melting temperature
Title (en)
Apparatus for die casting material having a high melting temperature
Title (de)
Vorrichtung zum Druckgiessen von Material mit hohem Schmelzpunkt
Title (fr)
Dispositif de moulage sous pression de matériaux a haut point de fusion
Publication
Application
Priority
US 11356698 P 19981223
Abstract (en)
A die casting apparatus for making articles composed of material having a melting temperature in excess of 2000 F, such as superalloys and titanium alloys includes a melting unit 24 for melting at least a charge of the material, and a multi part, die-cavity-defining die 36. A generally cylindrical shot sleeve 30 of the apparatus is in fluid communication with the die 36, and receives molten material from the melting unit 24. The sleeve 30 has outer and inner radii Ro, Ri. The apparatus also includes a plunger unit 40 in sealing and moveable engagement with the shot sleeve 30. The plunger 40 moves along a plunger stroke, for forcing material from the shot sleeve 30 into the die cavity 38. At least the radii and the ratio of the outer to inner radii are selected to minimize thermal distortion of the sleeve when molten material is poured into the sleeve. Preferably the inner radius Ri is at least 25 mm and the ratio Ro/Ri at least 1.3 Preferably, the shot sleeve 30 defines a volume that is at least 2 times the die cavity volume 38. <IMAGE>
IPC 1-7
IPC 8 full level
B22D 17/20 (2006.01)
CPC (source: EP)
B22D 17/2023 (2013.01)
Citation (search report)
- [DA] US 3646990 A 19720307 - CROSS RAYMOND E
- [DA] US 3532561 A 19701006 - BARTO RONALD L, et al
- [A] US 4086953 A 19780502 - KRAKLAU DAVID M
- [A] US 3516480 A 19700623 - WOLTERING JOSEPH A
- [A] DATABASE WPI Section Ch Week 197613, Derwent World Patents Index; Class M22, AN 1976-23507X, XP002135256
- [A] PATENT ABSTRACTS OF JAPAN vol. 010, no. 286 (M - 521) 27 September 1986 (1986-09-27)
Designated contracting state (EPC)
CH DE ES FR GB LI NL
DOCDB simple family (publication)
EP 1013363 A1 20000628; EP 1013363 B1 20050302; CN 1122587 C 20031001; CN 1260254 A 20000719; DE 69923930 D1 20050407; DE 69923930 T2 20060406; ES 2235445 T3 20050701; IL 133607 A0 20010430; IL 133607 A 20040328; JP 2000197957 A 20000718
DOCDB simple family (application)
EP 99310240 A 19991220; CN 99127818 A 19991223; DE 69923930 T 19991220; ES 99310240 T 19991220; IL 13360799 A 19991220; JP 36051899 A 19991220