EP 1013432 A2 20000628 - Cooling of high voltage driver chips
Title (en)
Cooling of high voltage driver chips
Title (de)
Kühlung von Hochspannungstreiberchips
Title (fr)
Refroidissement de puces de circuit de commande à haute tension
Publication
Application
Priority
US 21125198 A 19981214
Abstract (en)
A compact cooling technique is provided for cooling an ink jet printer or printhead electronics. A cooling plate (18) is held in good thermal contact to the integrated circuits (12) to be cooled. Fluid passing through the cooling plate then cools the electronics. The cooling plate is typically an aluminum plate embedded with thin walled stainless steel tubing through which fluid flows to provide cooling. The cooling plate has a compliant pad (26) which is thermally conductive, and electrically insulated. The plate and pad combination is held against the integrated circuits for controlling the high voltage to the charging electrodes, which are mounted on the charge driver board. The integrated circuit is packaged in a cavity down ball grid array (BGA) package which provides low thermal resistance to the cooling plate. Variations in the height of the charge driver chips is compensated for by the compliant thermal pad. The fluid is routed through the printhead frame into the cold plate where heat is transferred to the fluid which returns to the printhead frame to exit the printhead. The fluid is ported into the printhead to where the drops will be generated. <IMAGE>
IPC 1-7
IPC 8 full level
B41J 2/02 (2006.01); B41J 2/175 (2006.01); B41J 29/377 (2006.01)
CPC (source: EP)
B41J 2/02 (2013.01); B41J 29/377 (2013.01); B41J 2202/08 (2013.01)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1013432 A2 20000628; EP 1013432 A3 20000830; CA 2292046 A1 20000614; JP 2000218828 A 20000808
DOCDB simple family (application)
EP 99309507 A 19991129; CA 2292046 A 19991210; JP 35485799 A 19991214