Global Patent Index - EP 1016120 A1

EP 1016120 A1 20000705 - RESISTIVE HEATING OF POWER COIL TO REDUCE TRANSIENT HEATING/START UP EFFECTS

Title (en)

RESISTIVE HEATING OF POWER COIL TO REDUCE TRANSIENT HEATING/START UP EFFECTS

Title (de)

WIDERSTANDHEIZUNG EINER LEISTUNGSSPULE UM TRANSIENTE HEIZUNG/STARTVORGANG EFFEKTE ZU VERMINDERN

Title (fr)

CHAUFFAGE PAR RESISTANCE D'UNE BOBINE DE PUISSANCE VISANT A REDUIRE LES EFFETS DU CHAUFFAGE/DEMARRAGE TRANSITOIRES

Publication

EP 1016120 A1 20000705 (EN)

Application

EP 98948219 A 19980915

Priority

  • US 9819165 W 19980915
  • US 93117097 A 19970916

Abstract (en)

[origin: WO9914790A1] A method and apparatus for preheating a coil used to generate a plasma field in a processing chamber in a semiconductor fabrication system. The coil is preheated in the chamber prior to sputter depositing material onto a substrate and workpiece. The coil is preheated to a predetermined temperature, which is preferably equal to or greater than the equilibrium temperature attained by the coil during sputter deposition processes. Preheating may be effected with a preheating current having a frequency lower than the minimum frequency required to ignite a plasma, or when the processing chamber contains an atmosphere which prevents formation of a plasma. The coil may preheated for a predetermined time period.

IPC 1-7

H01J 37/32; H01J 37/34

IPC 8 full level

C23C 14/40 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01L 21/302 (2006.01); H01L 21/3065 (2006.01)

CPC (source: EP KR US)

H01J 37/32 (2013.01 - KR); H01J 37/32009 (2013.01 - EP US); H01J 37/321 (2013.01 - EP US); H01J 37/32174 (2013.01 - EP US); H01J 37/34 (2013.01 - EP US); H01J 37/3402 (2013.01 - EP US); H01J 2237/022 (2013.01 - EP US)

Citation (search report)

See references of WO 9914790A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 9914790 A1 19990325; EP 1016120 A1 20000705; JP 2001516949 A 20011002; KR 20010023947 A 20010326; TW 503262 B 20020921; US 6023038 A 20000208

DOCDB simple family (application)

US 9819165 W 19980915; EP 98948219 A 19980915; JP 2000512234 A 19980915; KR 20007002652 A 20000313; TW 87115271 A 19980914; US 93117097 A 19970916