Global Patent Index - EP 1017517 A1

EP 1017517 A1 20000712 - A METHOD FOR PUNCHING AND A PUNCH DIE

Title (en)

A METHOD FOR PUNCHING AND A PUNCH DIE

Title (de)

VERFAHREN ZUM STANZEN UND STANZVORRICHTUNG

Title (fr)

PROCEDE ET MATRICE DE POIN ONNAGE

Publication

EP 1017517 A1 20000712 (EN)

Application

EP 98928737 A 19980602

Priority

  • SE 9801044 W 19980602
  • SE 9702153 A 19970605

Abstract (en)

[origin: WO9855244A1] The invention relates to a method of punching one or more holes in a two-wall workpiece having mutually facing walls where one or more holes is/are to be punched in at least one wall. According to the method, there is inserted in the space between the walls a punch die that has a thickness corresponding essentially to the distance between the walls. The die includes one or more punch cavities. A punch tool having one or more punches is activated on the ouside of the wall subsequent to having moved the punch die to a position in which a punch cavity is located opposite its respective punch. The invention also relates to a punch die (8) for use when carrying out the method. The punch die (8) includes one or more punch cavities (7) and is adapted for insertion into the space between the wall (2, 3) of the two-wall workpiece (1).

IPC 1-7

B21D 28/28

IPC 8 full level

B21D 28/28 (2006.01); B26F 1/02 (2006.01); B26F 1/14 (2006.01)

CPC (source: EP)

B21D 28/28 (2013.01); B26F 1/02 (2013.01); B26F 1/14 (2013.01)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB IE IT LI NL SE

DOCDB simple family (publication)

WO 9855244 A1 19981210; AT E233138 T1 20030315; AU 8046398 A 19981221; DE 69811697 D1 20030403; DE 69811697 T2 20031023; DK 1017517 T3 20030610; EP 1017517 A1 20000712; EP 1017517 B1 20030226; SE 512912 C2 20000605; SE 9702153 D0 19970605; SE 9702153 L 19981206

DOCDB simple family (application)

SE 9801044 W 19980602; AT 98928737 T 19980602; AU 8046398 A 19980602; DE 69811697 T 19980602; DK 98928737 T 19980602; EP 98928737 A 19980602; SE 9702153 A 19970605