EP 1017538 A1 20000712 - WAFER PROCESSING APPARATUS
Title (en)
WAFER PROCESSING APPARATUS
Title (de)
VORRICHTUNG ZUM BEHANDELN VON HALBLEITERSCHEIBEN
Title (fr)
APPAREIL DE TRAITEMENT DE PLAQUETTES
Publication
Application
Priority
- US 9818214 W 19980902
- US 94309197 A 19970926
Abstract (en)
[origin: WO9916580A1] Wafer processing apparatus for batch processing of wafers comprises a turntable, having a polishing surface thereon, capable of rotation about a turntable rotation axis. A pressure plate is constructed for simultaneously holding mulitple wafers with a polish face of the wafers facing the polishing surface of the turntable. A polisher head capable of applying a normal force to the pressure plate is provided to drive the pressure plate toward the turntable so that the polish face of the wafers engages the polishing surface of the turntable for polishing of the wafers. A force distributing member intermediate the polisher head and the pressure plate is constructed for uniformly distributing the force applied by the polisher head to the pressure plate.
IPC 1-7
IPC 8 full level
B24B 41/06 (2012.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B24B 37/30 (2013.01 - EP US); B24B 41/06 (2013.01 - EP US); H01L 21/302 (2013.01 - KR)
Citation (search report)
See references of WO 9916580A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9916580 A1 19990408; CN 1271306 A 20001025; EP 1017538 A1 20000712; JP 2001518396 A 20011016; KR 20010024166 A 20010326; TW 374039 B 19991111; US 5975998 A 19991102
DOCDB simple family (application)
US 9818214 W 19980902; CN 98809480 A 19980902; EP 98943517 A 19980902; JP 2000513699 A 19980902; KR 20007002934 A 20000320; TW 87115971 A 19980925; US 94309197 A 19970926