Global Patent Index - EP 1018147 A1

EP 1018147 A1 20000712 - METHOD FOR PRODUCING A COMPOSITE PART AND COMPOSITE PART

Title (en)

METHOD FOR PRODUCING A COMPOSITE PART AND COMPOSITE PART

Title (de)

VERFAHREN ZUM HERSTELLEN EINES VERBUNDTEILS UND VERBUNDTEIL

Title (fr)

PROCEDE DE PRODUCTION D'UNE PIECE COMPOSITE, ET PIECE COMPOSITE

Publication

EP 1018147 A1 20000712 (DE)

Application

EP 98949891 A 19980814

Priority

  • DE 9802359 W 19980814
  • DE 19741924 A 19970923

Abstract (en)

[origin: DE19741924A1] The invention relates to a method for producing a composite part consisting of a component and a glass plate (10). According to said method, a body (1) formed by a semiconductor substrate is brought into contact with the glass plate (10) and an electric voltage is applied between the body (1) and the glass plate (10), said voltage been high enough to move the ions contained in the glass plate (10). Before the body (1) and the glass plate (10) are assembled, a connecting layer (8) containing silicon is applied on the body (1). Before the connection layer (8) is applied, at least one additional layer (2) is formed in or applied on the body (1) and doping agents are implanted on the additional layer (2).

IPC 1-7

H01L 21/20

IPC 8 full level

B41J 2/05 (2006.01); B41J 2/16 (2006.01); C03C 27/04 (2006.01); C04B 37/04 (2006.01); H01L 21/20 (2006.01); H01L 21/326 (2006.01); H01L 21/58 (2006.01)

CPC (source: EP KR)

B32B 18/00 (2013.01 - EP); C03C 27/044 (2013.01 - EP); C04B 37/045 (2013.01 - EP); H01L 21/20 (2013.01 - KR); H01L 24/26 (2013.01 - EP); H01L 24/83 (2013.01 - EP); C04B 2235/666 (2013.01 - EP); C04B 2237/16 (2013.01 - EP); C04B 2237/30 (2013.01 - EP); C04B 2237/36 (2013.01 - EP); C04B 2237/52 (2013.01 - EP); C04B 2237/561 (2013.01 - EP); H01L 2224/8319 (2013.01 - EP); H01L 2224/8385 (2013.01 - EP); H01L 2924/01011 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01049 (2013.01 - EP); H01L 2924/01068 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/07802 (2013.01 - EP); H01L 2924/09701 (2013.01 - EP); H01L 2924/10329 (2013.01 - EP); H01L 2924/12036 (2013.01 - EP); H01L 2924/12043 (2013.01 - EP)

Citation (search report)

See references of WO 9916114A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

DE 19741924 A1 19990401; DE 19741924 C2 20000302; EP 1018147 A1 20000712; JP 2001517869 A 20011009; KR 20010024238 A 20010326; WO 9916114 A1 19990401

DOCDB simple family (application)

DE 19741924 A 19970923; DE 9802359 W 19980814; EP 98949891 A 19980814; JP 2000513313 A 19980814; KR 20007003056 A 20000322