Global patent index - EP 1018147 A1

EP 1018147 A1 2000-07-12 - METHOD FOR PRODUCING A COMPOSITE PART AND COMPOSITE PART

Title (en)

METHOD FOR PRODUCING A COMPOSITE PART AND COMPOSITE PART

Title (de)

VERFAHREN ZUM HERSTELLEN EINES VERBUNDTEILS UND VERBUNDTEIL

Title (fr)

PROCEDE DE PRODUCTION D'UNE PIECE COMPOSITE, ET PIECE COMPOSITE

Publication

EP 1018147 A1 (DE)

Application

EP 98949891 A

Priority

  • DE 9802359 W
  • DE 19741924 A

Abstract (en)

[origin: DE19741924A1] The invention relates to a method for producing a composite part consisting of a component and a glass plate (10). According to said method, a body (1) formed by a semiconductor substrate is brought into contact with the glass plate (10) and an electric voltage is applied between the body (1) and the glass plate (10), said voltage been high enough to move the ions contained in the glass plate (10). Before the body (1) and the glass plate (10) are assembled, a connecting layer (8) containing silicon is applied on the body (1). Before the connection layer (8) is applied, at least one additional layer (2) is formed in or applied on the body (1) and doping agents are implanted on the additional layer (2).

IPC 1-7 (main, further and additional classification)

H01L 21/20

IPC 8 full level (invention and additional information)

B41J 2/05 (2006.01); B41J 2/16 (2006.01); C03C 27/04 (2006.01); C04B 37/04 (2006.01); H01L 21/20 (2006.01); H01L 21/326 (2006.01); H01L 21/58 (2006.01)

CPC (invention and additional information)

H01L 24/83 (2013.01); B32B 18/00 (2013.01); C03C 27/044 (2013.01); C04B 37/045 (2013.01); H01L 24/26 (2013.01); C04B 2235/666 (2013.01); C04B 2237/16 (2013.01); C04B 2237/30 (2013.01); C04B 2237/36 (2013.01); C04B 2237/52 (2013.01); C04B 2237/561 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/8385 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12043 (2013.01)

Combination set (CPC)

  1. H01L 2924/12036 + H01L 2924/00
  2. H01L 2924/12043 + H01L 2924/00

Citation (search report)

See references of WO 9916114A1

Designated contracting state (EPC)

DE FR GB

EPO simple patent family

DE 19741924 A1 19990401; DE 19741924 C2 20000302; EP 1018147 A1 20000712; JP 2001517869 A 20011009; WO 9916114 A1 19990401

INPADOC legal status

2003-06-11 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20021008

2001-07-18 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20010601

2000-07-12 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000317

2000-07-12 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB