Global Patent Index - EP 1019961 A1

EP 1019961 A1 20000719 - METHOD FOR PRODUCING A MULTILEVEL CABLE CARRIER (SUBSTRATE), ESPECIALLY FOR MULTICHIP MODULES

Title (en)

METHOD FOR PRODUCING A MULTILEVEL CABLE CARRIER (SUBSTRATE), ESPECIALLY FOR MULTICHIP MODULES

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES MEHREBENEN-VERDRAHTUNGSTRÄGERS (SUBSTRAT), INSBESONDERE FÜR MULTICHIPMODULE

Title (fr)

PROCEDE DE PRODUCTION D'UN SUPPORT DE CABLAGE (SUBSTRAT) A PLUSIEURS PLANS, EN PARTICULIER POUR MODULES MULTIPUCES

Publication

EP 1019961 A1 20000719 (DE)

Application

EP 98955336 A 19980916

Priority

  • DE 9802742 W 19980916
  • DE 19743365 A 19970930

Abstract (en)

[origin: DE19743365A1] The conductor track system is applied simultaneously to several individual substrates in several coating and microstructuring steps. Said substrates form a single piece and are separated only after structuring has occurred. In order to produce ready-made thin substrates, the individual substrates are processed at least during structuring in the form of a strip.

IPC 1-7

H01L 23/498

IPC 8 full level

H01L 23/12 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 1/00 (2006.01); H05K 3/06 (2006.01)

CPC (source: EP)

H01L 23/4985 (2013.01); H05K 3/0097 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0393 (2013.01); H05K 3/064 (2013.01); H05K 2201/0317 (2013.01); H05K 2203/1545 (2013.01)

Citation (search report)

See references of WO 9917363A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

DE 19743365 A1 19990408; EP 1019961 A1 20000719; JP 2001518713 A 20011016; TW 437018 B 20010528; WO 9917363 A1 19990408

DOCDB simple family (application)

DE 19743365 A 19970930; DE 9802742 W 19980916; EP 98955336 A 19980916; JP 2000514330 A 19980916; TW 87114630 A 19980903