EP 1021575 A1 20000726 - COPPER BASED ALLOY FEATURING PRECIPITATION HARDENING AND SOLID-SOLUTION HARDENING

Title (en)

COPPER BASED ALLOY FEATURING PRECIPITATION HARDENING AND SOLID-SOLUTION HARDENING

Title (de)

LEGIERUNG AUF KUPFERBASIS, GEKENNZEICHNET DURCH AUSSCHEIDUNGSHÄRTUNG UND DURCH HÄRTUNG IM FESTEN ZUSTAND

Title (fr)

ALLIAGE AU CUIVRE PRESENTANT DES CARACTERISTIQUES DE TREMPE STRUCTURALE ET DE DURCISSEMENT EN SOLUTION SOLIDE

Publication

EP 1021575 A1 20000726 (EN)

Application

EP 98943252 A 19980821

Priority

US 9817196 W 19980821
US 5777997 P 19970905

Abstract (en)

[origin: WO9913117A1] A phosphor bronze alloy consisting of: 0.4 to 3.0 wt.% Ni, 1.0 to 11.0 wt.% Sn, 0.1 to 1.0 wt.% Si, 0.01 to 0.35 wt.% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.

IPC 1-7

C22C 9/02; C22C 9/06; H01R 13/03

IPC 8 full level

C22C 9/02 (2006.01); C22C 9/06 (2006.01)

CPC (source: EP KR)

C22C 9/02 (2013.01 - EP KR); C22C 9/06 (2013.01 - EP)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9913117 A1 19990318; AR 017044 A1 20010822; AT E240413 T1 20030515; AU 9108398 A 19990329; BR 9811448 A 20000822; CA 2303164 A1 19990318; CN 1097095 C 20021225; CN 1275171 A 20001129; DE 69814657 D1 20030618; DE 69814657 T2 20040325; EP 1021575 A1 20000726; EP 1021575 B1 20030514; JP 2001515960 A 20010925; KR 20010023699 A 20010326; TW 364019 B 19990711

DOCDB simple family (application)

US 9817196 W 19980821; AR P980104367 A 19980901; AT 98943252 T 19980821; AU 9108398 A 19980821; BR 9811448 A 19980821; CA 2303164 A 19980821; CN 98810040 A 19980821; DE 69814657 T 19980821; EP 98943252 A 19980821; JP 2000510901 A 19980821; KR 20007002353 A 20000304; TW 87114229 A 19980827