Global Patent Index - EP 1021831 A1

EP 1021831 A1 20000726 - IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME

Title (en)

IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME

Title (de)

VERBESSERTE LEITERRAHMERSTRUKTUR MIT VORPLATIERTEN FINGERN UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

STRUCTURE DE GRILLE DE CONNEXION AMELIOREE A CONNECTEURS PREMETALLISES ET PROCEDE DE FABRICATION

Publication

EP 1021831 A1 20000726 (EN)

Application

EP 98910140 A 19980105

Priority

  • US 9804119 W 19980105
  • US 79077997 A 19970130

Abstract (en)

[origin: WO9834277A1] An improved leadframe structure, process of manufacturing the same, and improved IC package (190) and packaging process using the same are provided. The leadframe includes a plurality of leads (85) having inner portions (95) located within an IC encapsulation area and outer portions (80) extending outside the encapsulation area into contact with the ou tside environment. A plating mask cooperates with a polymer structure having a preselected configuration to form a substantially fluid-tight gasket to facilitate selective preplating (92) of the outer portions of the leads of the leadframe prior to beginning the IC packaging process. Since the polymer structure (160) is electrically insulative, concerns regarding plating mask (200) misalignment are minimized.

IPC 1-7

H01L 23/48

IPC 8 full level

H01L 23/495 (2006.01); H01L 23/50 (2006.01)

CPC (source: EP)

H01L 23/49558 (2013.01); H01L 23/49582 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48639 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15747 (2013.01)

Citation (search report)

See references of WO 9834277A1

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9834277 A1 19980806; EP 1021831 A1 20000726; JP 2002511187 A 20020409; TW 383436 B 20000301; TW 444309 B 20010701

DOCDB simple family (application)

US 9804119 W 19980105; EP 98910140 A 19980105; JP 53326998 A 19980105; TW 87100777 A 19980121; TW 87100906 A 19980121