Global Patent Index - EP 1021831 A1

EP 1021831 A1 2000-07-26 - IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME

Title (en)

IMPROVED LEADFRAME STRUCTURE WITH PREPLATED LEADS AND PROCESS FOR MANUFACTURING THE SAME

Title (de)

VERBESSERTE LEITERRAHMERSTRUKTUR MIT VORPLATIERTEN FINGERN UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

STRUCTURE DE GRILLE DE CONNEXION AMELIOREE A CONNECTEURS PREMETALLISES ET PROCEDE DE FABRICATION

Publication

EP 1021831 A1 (EN)

Application

EP 98910140 A

Priority

  • US 9804119 W
  • US 79077997 A

Abstract (en)

[origin: WO9834277A1] An improved leadframe structure, process of manufacturing the same, and improved IC package (190) and packaging process using the same are provided. The leadframe includes a plurality of leads (85) having inner portions (95) located within an IC encapsulation area and outer portions (80) extending outside the encapsulation area into contact with the ou tside environment. A plating mask cooperates with a polymer structure having a preselected configuration to form a substantially fluid-tight gasket to facilitate selective preplating (92) of the outer portions of the leads of the leadframe prior to beginning the IC packaging process. Since the polymer structure (160) is electrically insulative, concerns regarding plating mask (200) misalignment are minimized.

IPC 1-7 (main, further and additional classification)

H01L 23/48

IPC 8 full level (invention and additional information)

H01L 23/50 (2006.01); H01L 23/495 (2006.01)

CPC (invention and additional information)

H01L 23/49558 (2013.01); H01L 23/49582 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48639 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85464 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15747 (2013.01)

Combination set (CPC)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2224/45144 + H01L 2924/00014
  3. H01L 2924/15747 + H01L 2924/00
  4. H01L 2224/48639 + H01L 2924/00
  5. H01L 2224/48664 + H01L 2924/00
  6. H01L 2924/14 + H01L 2924/00

Citation (search report)

See references of WO 9834277A1

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9834277 A1 19980806; EP 1021831 A1 20000726; JP 2002511187 A 20020409; TW 383436 B 20000301; TW 444309 B 20010701

INPADOC legal status


2006-02-08 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20050802

2000-07-26 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 19990830

2000-07-26 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE