EP 1021838 A1 20000726 - METHOD AND DEVICE FOR PRODUCING A WAFER FROM A SEMICONDUCTING MATERIAL
Title (en)
METHOD AND DEVICE FOR PRODUCING A WAFER FROM A SEMICONDUCTING MATERIAL
Title (de)
VERFAHREN UND VORRICHTUNG ZUM HERSTELLEN EINER SCHEIBE AUS HALBLEITENDEM MATERIAL
Title (fr)
PROCEDE ET DISPOSITIF POUR LA FABRICATION D'UNE TRANCHE EN MATERIAU SEMI-CONDUCTEUR
Publication
Application
Priority
- DE 19742653 A 19970926
- EP 9806082 W 19980924
Abstract (en)
[origin: DE19742653A1] The invention relates to a method for producing a wafer from a semiconducting material, especially a silicon wafer, for a solar cell. According to the inventive method, a melt of the semiconducting material (8) sets to form the wafer. The invention is characterised in that said melt is exposed to an electric and/or magnetic field at least during the start of the setting process.
IPC 1-7
IPC 8 full level
C30B 11/00 (2006.01); C30B 29/64 (2006.01); H01L 31/04 (2006.01); H01L 31/18 (2006.01)
CPC (source: EP)
C30B 11/00 (2013.01); C30B 29/06 (2013.01); H01L 31/1804 (2013.01); Y02E 10/547 (2013.01); Y02P 70/50 (2015.11)
Citation (search report)
See references of WO 9917381A1
Designated contracting state (EPC)
AT CH DE ES FR GB IT LI SE
DOCDB simple family (publication)
DE 19742653 A1 19990401; CN 1271465 A 20001025; EP 1021838 A1 20000726; JP 2001518720 A 20011016; WO 9917381 A1 19990408
DOCDB simple family (application)
DE 19742653 A 19970926; CN 98809536 A 19980924; EP 9806082 W 19980924; EP 98947547 A 19980924; JP 2000514344 A 19980924