EP 1022760 A3 20010502 - Method of manufacturing a contact for a vacuum switch
Title (en)
Method of manufacturing a contact for a vacuum switch
Title (de)
Verfahren zum Herstellen einer Kontaktanordnung für eine Vakuumschaltröhre
Title (fr)
Procédé de fabrication d'un contact pour interrupteur à vide
Publication
Application
Priority
DE 19902500 A 19990122
Abstract (en)
[origin: EP1022760A2] A contact piece (10,20) is pressed directly onto the surface of a contact carrier (1,2), leaving a gap along the contact surface. A solder material is arranged in regions directly adjoining the gap, between the contact piece and contact carrier. Under vacuum, the solder material is melted by heating and the molten material penetrates the gap between the contact carrier and the contact piece.
IPC 1-7
IPC 8 full level
H01H 33/664 (2006.01); H01H 1/02 (2006.01); H01H 11/04 (2006.01)
CPC (source: EP US)
H01H 33/664 (2013.01 - EP US); H01H 1/0206 (2013.01 - EP US); H01H 11/045 (2013.01 - EP US); Y10T 29/49208 (2015.01 - EP US); Y10T 29/4921 (2015.01 - EP US); Y10T 29/49211 (2015.01 - EP US); Y10T 29/49213 (2015.01 - EP US)
Citation (search report)
- [A] US 3055098 A 19620925 - BRATKOWSKI WALTER V, et al
- [A] GB 415221 A 19340823 - CLEMENTS ALBERT LAISE
- [A] US 3191274 A 19650629 - GWYN JR CHILDRESS B, et al
- [DA] DE 4447391 C1 19960605 - SIEMENS AG [DE]
- [A] DE 1127180 B 19620405 - SIEMENS AG
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1022760 A2 20000726; EP 1022760 A3 20010502; EP 1022760 B1 20051221; AT E313852 T1 20060115; DE 19902500 A1 20000817; DE 19902500 B4 20040722; DE 50011875 D1 20060126; ES 2255470 T3 20060701; US 6574864 B1 20030610
DOCDB simple family (application)
EP 00100967 A 20000119; AT 00100967 T 20000119; DE 19902500 A 19990122; DE 50011875 T 20000119; ES 00100967 T 20000119; US 48875500 A 20000121