EP 1023374 A1 20000802 - CONDUCTIVE THERMOSET MOLDING COMPOSITION AND METHOD FOR PRODUCING SAME
Title (en)
CONDUCTIVE THERMOSET MOLDING COMPOSITION AND METHOD FOR PRODUCING SAME
Title (de)
LEITFÄHIGE, WÄRMEHÄRTENDE FORMMASSE SOWIE VERFAHREN ZU IHRER HERSTELLUNG
Title (fr)
COMPOSITE THERMODURCISSABLE MOULABLE ET SON PROCEDE D'OBTENTION
Publication
Application
Priority
- US 9821748 W 19981014
- US 6192097 P 19971014
Abstract (en)
[origin: WO9919389A1] A high filler conductive thermoset composite that may be used in bipolar plates is provided in which the composite may be used to form thin wall, electrically and thermally conductive structures that have sufficient toughness and are resistant to the harsh fuel cell environment.
IPC 1-7
IPC 8 full level
C08G 59/62 (2006.01); C08K 3/00 (2006.01); C08K 3/04 (2006.01); C08L 101/00 (2006.01); H01B 1/24 (2006.01); H01M 8/02 (2006.01)
CPC (source: EP KR)
C08K 3/04 (2013.01 - EP KR); C08L 63/00 (2013.01 - KR); H01B 1/24 (2013.01 - EP KR); H01M 8/0204 (2013.01 - EP KR); H01M 8/0213 (2013.01 - EP KR); H01M 8/0226 (2013.01 - EP KR); C08K 2201/001 (2013.01 - KR); Y02E 60/50 (2013.01 - EP)
Citation (search report)
See references of WO 9919389A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9919389 A1 19990422; AU 1087599 A 19990503; AU 757196 B2 20030206; BR 9814819 A 20011113; CA 2306144 A1 19990422; CN 1282349 A 20010131; EP 1023374 A1 20000802; JP 2001520245 A 20011030; KR 20010031139 A 20010416; NO 20001925 D0 20000413; NO 20001925 L 20000613
DOCDB simple family (application)
US 9821748 W 19981014; AU 1087599 A 19981014; BR 9814819 A 19981014; CA 2306144 A 19981014; CN 98812178 A 19981014; EP 98953530 A 19981014; JP 2000515954 A 19981014; KR 20007004038 A 20000414; NO 20001925 A 20000413