EP 1023469 A1 20000802 - METHOD OF MAKING A STRUCTURE WITH IMPROVED MATERIAL PROPERTIES BY MODERATE HEAT TREATMENT OF A METAL DEPOSIT
Title (en)
METHOD OF MAKING A STRUCTURE WITH IMPROVED MATERIAL PROPERTIES BY MODERATE HEAT TREATMENT OF A METAL DEPOSIT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER STRUKTUR MIT VERBESSERTEN WERKSTOFFEIGENSCHAFTEN DURCH MÄSSIGE WÄRMEBEHANDLUNG EINER METALLBESCHICHTUNG
Title (fr)
PROCEDE D'OBTENTION DE STRUCTURES AUX PROPRIETES MECANIQUES AMELIOREES PAR TRAITEMENT THERMIQUE MODERE D'UN DEPOT METALLIQUE
Publication
Application
Priority
- US 9812094 W 19980611
- US 93192397 A 19970917
Abstract (en)
[origin: WO9914404A1] Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 DEG C. This technique involves depositing a material (206) in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment (106). This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. For example, coating and heat treating a spring-shaped elongate member provides a resilient, conductive contact (212, 920, 1060) useful for electronic applications.
IPC 1-7
IPC 8 full level
B81B 7/00 (2006.01); C25D 5/50 (2006.01); C25D 7/00 (2006.01); C25D 7/12 (2006.01); G01R 1/067 (2006.01); H01L 21/00 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/32 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP KR)
B81B 7/0006 (2013.01 - EP KR); C25D 5/617 (2020.08 - KR); C25D 5/619 (2020.08 - KR); C25D 7/0614 (2013.01 - EP KR); H01L 21/4846 (2013.01 - EP KR); H01L 21/67288 (2013.01 - EP); H01L 24/11 (2013.01 - EP KR); H01L 24/13 (2013.01 - EP KR); H01L 24/16 (2013.01 - EP KR); C25D 3/562 (2013.01 - KR); H01L 21/67288 (2013.01 - KR); H01L 2224/0231 (2013.01 - EP KR); H01L 2224/02335 (2013.01 - EP KR); H01L 2224/0401 (2013.01 - EP KR); H01L 2224/11472 (2013.01 - EP KR); H01L 2224/11474 (2013.01 - EP KR); H01L 2224/13012 (2013.01 - EP KR); H01L 2224/13016 (2013.01 - EP KR); H01L 2224/13099 (2013.01 - EP); H01L 2224/13144 (2013.01 - EP); H01L 2224/45144 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01011 (2013.01 - EP); H01L 2924/01012 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01016 (2013.01 - EP); H01L 2924/01022 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01024 (2013.01 - EP); H01L 2924/01025 (2013.01 - EP); H01L 2924/01027 (2013.01 - EP); H01L 2924/01028 (2013.01 - EP KR); H01L 2924/01029 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01039 (2013.01 - EP); H01L 2924/01042 (2013.01 - EP); H01L 2924/01045 (2013.01 - EP); H01L 2924/01046 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01057 (2013.01 - EP); H01L 2924/01061 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01076 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/014 (2013.01 - EP KR); H01L 2924/14 (2013.01 - EP KR); H01L 2924/30107 (2013.01 - EP KR)
Citation (search report)
See references of WO 9914404A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9914404 A1 19990325; AU 7959298 A 19990405; CN 1278308 A 20001227; EP 1023469 A1 20000802; JP 2001516812 A 20011002; KR 20010024022 A 20010326; TW 473562 B 20020121
DOCDB simple family (application)
US 9812094 W 19980611; AU 7959298 A 19980611; CN 98810843 A 19980611; EP 98930127 A 19980611; JP 2000511937 A 19980611; KR 20007002755 A 20000316; TW 87120343 A 19981208