EP 1024531 A2 20000802 - Semiconductor wafer and device having columnar electrodes
Title (en)
Semiconductor wafer and device having columnar electrodes
Title (de)
Halbleiterscheibe und Anordnung mit säulenförmigen Elektroden
Title (fr)
Plaquette semi-conductrice et dispositif avec des électrodes en forme de colonne
Publication
Application
Priority
- JP 1822999 A 19990127
- JP 1823799 A 19990127
Abstract (en)
A semiconductor wafer (10) provided with columnar electrodes (24) which have plated nickel (42), palladium (44), and gold (46) films successively formed at the top thereof, or have a plated solder film (47) at their top. The semiconductor wafer (10) can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes (24) to which an external connection terminal, such as a solder ball (50), is to be bonded. Methods of producing the semiconductor wafer (10) and device by use of plating are also disclosed. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/485 (2006.01)
CPC (source: EP KR US)
H01L 21/60 (2021.08 - KR); H01L 24/11 (2013.01 - EP US); H01L 24/13 (2013.01 - EP US); H01L 24/03 (2013.01 - EP); H01L 24/05 (2013.01 - EP); H01L 2224/023 (2013.01 - EP); H01L 2224/05001 (2013.01 - EP US); H01L 2224/05008 (2013.01 - EP US); H01L 2224/05026 (2013.01 - EP US); H01L 2224/05569 (2013.01 - EP US); H01L 2224/1146 (2013.01 - EP US); H01L 2224/1147 (2013.01 - EP US); H01L 2224/11849 (2013.01 - EP US); H01L 2224/13099 (2013.01 - EP US); H01L 2224/131 (2013.01 - EP US); H01L 2924/0001 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1024531 A2 20000802; EP 1024531 A3 20011128; KR 100687548 B1 20070227; KR 20000053618 A 20000825; TW 444288 B 20010701; US 2003096495 A1 20030522; US 7220657 B2 20070522
DOCDB simple family (application)
EP 00300613 A 20000127; KR 20000003629 A 20000126; TW 89101296 A 20000126; US 32364502 A 20021220