Global Patent Index - EP 1024910 B1

EP 1024910 B1 20021204 - DEVICE FOR ENCAPSULATING BLANKS IN HIGH-TEMPERATURE METALLIC ALLOYS

Title (en)

DEVICE FOR ENCAPSULATING BLANKS IN HIGH-TEMPERATURE METALLIC ALLOYS

Title (de)

VORRICHTUNG ZUR KAPSELUNG VON ROHLINGEN AUS METALLISCHEN HOCHTEMPERATUR-LEGIERUNGEN

Title (fr)

DISPOSITIF D'ENCAPSULAGE D'EBAUCHES EN ALLIAGES METALLIQUES HAUTE TEMPERATURE

Publication

EP 1024910 B1 20021204 (DE)

Application

EP 98949898 A 19980817

Priority

  • DE 9802369 W 19980817
  • DE 19747257 A 19971025

Abstract (en)

[origin: US6420051B1] In a device for encapsulating blanks of metallic high temperature alloys, particularly TiAL alloys, which are subjected to forging or rolling for hot forming, at least a first inner envelope is supported on the blank in closely spaced relationship therefrom and a second envelope surrounds the first envelope and both envelopes consist of a metallic material.

IPC 1-7

B21C 23/22; B21C 23/00

IPC 8 full level

B21C 23/00 (2006.01); B21C 23/22 (2006.01)

CPC (source: EP US)

B21C 23/22 (2013.01 - EP US); B21C 33/004 (2013.01 - EP US); Y10T 428/12229 (2015.01 - EP US); Y10T 428/12389 (2015.01 - EP US); Y10T 428/12806 (2015.01 - EP US)

Designated contracting state (EPC)

AT DE FR GB

DOCDB simple family (publication)

US 6420051 B1 20020716; AT E228896 T1 20021215; DE 19747257 A1 19990506; DE 19747257 C2 20010426; DE 59806564 D1 20030116; EP 1024910 A1 20000809; EP 1024910 B1 20021204; WO 9921667 A1 19990506

DOCDB simple family (application)

US 55758400 A 20000422; AT 98949898 T 19980817; DE 19747257 A 19971025; DE 59806564 T 19980817; DE 9802369 W 19980817; EP 98949898 A 19980817