EP 1025409 A1 20000809 - IMPROVED CHEMICAL DRYING AND CLEANING SYSTEM
Title (en)
IMPROVED CHEMICAL DRYING AND CLEANING SYSTEM
Title (de)
VERBESSERTES CHEMISCHES TROCKNUNGS- UND REINIGUNGSSYSTEM
Title (fr)
SYSTEME CHIMIQUE AMELIORE DE SECHAGE ET DE NETTOYAGE
Publication
Application
Priority
- US 9819793 W 19980922
- US 93567197 A 19970923
- US 3436998 A 19980303
- US 10946098 A 19980702
Abstract (en)
[origin: WO9915845A1] A system (11) for drying and/or cleaning a workpiece (17A), such as an electronic part, semiconductor wafer, printed circuit board or the like. As the workpiece is withdrawn from a processing or rinsing liquid (13), a selected drying and/or cleaning liquid, such as hydrofluoroether (HFE), an ethylated hydrofluoroether or an azeotrope of a hydrofluoroether or ethylated hydrofluoroether, that has a very small surface tension, is volatile, and has a density much greater than the processing liquid density, is sprayed on, dribbled on, or otherwise transferred to an exposed surface of the workpiece. The workpiece can be dried in 7-45 seconds, or less, in most situations and can be cleaned using the invention. Drying and/or cleaning can be performed in a single workpiece process, a single workpiece, continuous process, or a batch process.
IPC 1-7
IPC 8 full level
F26B 5/00 (2006.01); F26B 9/06 (2006.01); F26B 21/14 (2006.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01); H05K 3/26 (2006.01)
CPC (source: EP)
H01L 21/67034 (2013.01); H01L 21/6704 (2013.01); H05K 3/26 (2013.01)
Citation (search report)
See references of WO 9915845A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9915845 A1 19990401; CA 2303979 A1 19990401; CN 1125963 C 20031029; CN 1284159 A 20010214; EP 1025409 A1 20000809; JP 2001517864 A 20011009; JP 4299966 B2 20090722
DOCDB simple family (application)
US 9819793 W 19980922; CA 2303979 A 19980922; CN 98811068 A 19980922; EP 98948428 A 19980922; JP 2000513098 A 19980922