EP 1025573 A1 20000809 - METHOD FOR PRODUCING A RELAY
Title (en)
METHOD FOR PRODUCING A RELAY
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES RELAIS
Title (fr)
PROCEDE DE PRODUCTION D'UN RELAIS
Publication
Application
Priority
- DE 9802729 W 19980915
- DE 19747166 A 19971024
Abstract (en)
[origin: WO9922392A1] A coil form (1) is injection moulded to form the base body of the relay. At least one fixed contact carrier (3,4), one contact-spring contact pin (5) and coil contact pins (9,10) embodied as wire sections in the form of drawn semi-finished products are introduced into the mould and extrusion-coated. The core (16) can also be embedded into the material of the coil form (1) if so desired. This dispenses with assembly processes involving the abrasion of plastic particles which can later become deposited on the contacts. All connector pieces can be mounted in a cost-effective manner in the injection mould, requiring as little material as possible by virtue of the fact that there is no wastage when the semi-finished wires are separated.
IPC 1-7
IPC 8 full level
H01H 49/00 (2006.01); H01H 50/04 (2006.01); H01H 50/14 (2006.01); H01H 50/44 (2006.01); H01H 50/54 (2006.01); H01H 11/06 (2006.01); H01H 50/26 (2006.01); H01H 50/36 (2006.01)
CPC (source: EP KR US)
H01H 49/00 (2013.01 - EP KR US); H01H 50/042 (2013.01 - EP US); H01H 50/14 (2013.01 - EP US); H01H 11/06 (2013.01 - EP US); H01H 50/26 (2013.01 - EP US); H01H 50/36 (2013.01 - EP US); H01H 50/443 (2013.01 - EP US); H01H 50/54 (2013.01 - EP US); H01H 2011/0087 (2013.01 - EP US); Y10T 29/4902 (2015.01 - EP US); Y10T 29/49073 (2015.01 - EP US)
Designated contracting state (EPC)
AT CH DE ES FR GB IT LI PT
DOCDB simple family (publication)
WO 9922392 A1 19990506; AR 009912 A1 20000503; AT E216128 T1 20020415; BR 9813093 A 20000822; CA 2306787 A1 19990506; CA 2306787 C 20061114; CN 1146935 C 20040421; CN 1277730 A 20001220; DE 19747166 C1 19990602; DE 59803777 D1 20020516; EP 1025573 A1 20000809; EP 1025573 B1 20020410; ES 2173639 T3 20021016; JP 2001521272 A 20011106; KR 100509284 B1 20050822; KR 20010022285 A 20010315; TW 385464 B 20000321; US 6266867 B1 20010731
DOCDB simple family (application)
DE 9802729 W 19980915; AR P980105269 A 19981022; AT 98955329 T 19980915; BR 9813093 A 19980915; CA 2306787 A 19980915; CN 98810530 A 19980915; DE 19747166 A 19971024; DE 59803777 T 19980915; EP 98955329 A 19980915; ES 98955329 T 19980915; JP 2000518400 A 19980915; KR 20007000862 A 20000126; TW 87115572 A 19980918; US 44606199 A 19991216