EP 1027169 B1 20020109 - METHOD FOR CORROSION-RESISTANT COATING OF METAL SUBSTRATES BY MEANS OF PLASMA POLYMERISATION
Title (en)
METHOD FOR CORROSION-RESISTANT COATING OF METAL SUBSTRATES BY MEANS OF PLASMA POLYMERISATION
Title (de)
VERFAHREN ZUR KORROSIONSFESTEN BESCHICHTUNG VON METALLSUBSTRATEN MITTELS PLASMAPOLYMERISATION
Title (fr)
PROCEDE DE REVETEMENT ANTICORROSION DE SUBSTRATS METALLIQUES PAR POLYMERISATION AU PLASMA
Publication
Application
Priority
- DE 9803266 W 19981029
- DE 19748240 A 19971031
Abstract (en)
[origin: US2002014325A1] The invention relates to a metal substrate with a corrosion-resistant coating produced by means of plasma polymerisation, wherein the substrate is subjected to mechanical, chemical and/or electrochemical smoothing in a pre-treatment step and is subsequently exposed to a plasma at a temperature of less than 200° C. and at a pressure of 10-5 bis 100 mbars, whereby in a first step the surface is activated in a reducing plasma and in a second step the polymer is separated from a plasma containing at least one hydrocarbon or silico-organic compound which can be vaporized in plasma conditions, optionally contains oxygen, nitrogen or sulphur and can contain fluorine.
IPC 1-7
IPC 8 full level
B05D 7/14 (2006.01); B05D 1/00 (2006.01); B05D 3/14 (2006.01); B05D 7/24 (2006.01); C23C 16/50 (2006.01); C23G 5/00 (2006.01)
CPC (source: EP KR US)
B05D 1/62 (2013.01 - EP US); B05D 3/142 (2013.01 - EP US); B05D 7/14 (2013.01 - KR); C23G 5/00 (2013.01 - EP US); Y10T 428/31663 (2015.04 - EP US); Y10T 428/31678 (2015.04 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB GR IE IT LI NL SE
DOCDB simple family (publication)
US 2002014325 A1 20020207; US 6528170 B2 20030304; AT E211660 T1 20020115; AU 1662699 A 19990524; CZ 20001530 A3 20011212; CZ 297047 B6 20060816; DE 19748240 A1 19990506; DE 19748240 C2 20010523; DE 59802863 D1 20020228; DK 1027169 T3 20020402; EP 1027169 A2 20000816; EP 1027169 B1 20020109; ES 2172252 T3 20020916; HU P0401917 A2 20041228; HU P0401917 A3 20050428; JP 2001521820 A 20011113; JP 4263353 B2 20090513; KR 100377025 B1 20030326; KR 20010031646 A 20010416; NO 20002204 D0 20000428; NO 20002204 L 20000626; NO 326804 B1 20090216; US 6242054 B1 20010605; WO 9922878 A2 19990514; WO 9922878 A3 19990715
DOCDB simple family (application)
US 85920001 A 20010516; AT 98961076 T 19981029; AU 1662699 A 19981029; CZ 20001530 A 19981029; DE 19748240 A 19971031; DE 59802863 T 19981029; DE 9803266 W 19981029; DK 98961076 T 19981029; EP 98961076 A 19981029; ES 98961076 T 19981029; HU P0401917 A 19981029; JP 2000518798 A 19981029; KR 20007004699 A 20000429; NO 20002204 A 20000428; US 53040400 A 20000616