EP 1027189 A1 20000816 - LOW TEMPERATURE BOND FOR ABRASIVE TOOLS
Title (en)
LOW TEMPERATURE BOND FOR ABRASIVE TOOLS
Title (de)
NIEDRIGE TEMPERATURBINDUNG FÜR SCHLEIFWERKZEUGE
Title (fr)
LIAISON BASSE TEMPERATURE POUR OUTILS ABRASIFS
Publication
Application
Priority
- US 9815711 W 19980729
- US 96248297 A 19971031
Abstract (en)
[origin: US5863308A] The present invention provides a vitreous-bonded abrasive tool wherein the abrasive grit portion comprises a thermally sensitive abrasive grain, such as sintered sol gel microcrystalline alpha alumina abrasive grain or superabrasive grain, and wherein the vitrified bond may be matured by firing at a temperature below about 875 DEG C. The invention further includes a novel vitrified bond composition.
IPC 1-7
IPC 8 full level
B24D 3/00 (2006.01); B24D 3/14 (2006.01); C04B 35/10 (2006.01); C04B 35/111 (2006.01)
CPC (source: EP US)
B24D 3/14 (2013.01 - EP US); C04B 35/1115 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH DE DK ES FI FR GB IT LI LU NL PT SE
DOCDB simple family (publication)
US 5863308 A 19990126; AT E242085 T1 20030615; AU 726167 B2 20001102; AU 8600498 A 19990524; BR 9813167 A 20000822; CA 2305616 A1 19990514; CA 2305616 C 20040330; DE 69815375 D1 20030710; DE 69815375 T2 20040603; DK 1027189 T3 20030922; EP 1027189 A1 20000816; EP 1027189 B1 20030604; ES 2201516 T3 20040316; JP 2001521829 A 20011113; JP 2006255891 A 20060928; JP 2011131379 A 20110707; JP 4865426 B2 20120201; NZ 503552 A 20021220; PT 1027189 E 20031031; WO 9922910 A1 19990514
DOCDB simple family (application)
US 96248297 A 19971031; AT 98937249 T 19980729; AU 8600498 A 19980729; BR 9813167 A 19980729; CA 2305616 A 19980729; DE 69815375 T 19980729; DK 98937249 T 19980729; EP 98937249 A 19980729; ES 98937249 T 19980729; JP 2000518816 A 19980729; JP 2006185571 A 20060705; JP 2011085207 A 20110407; NZ 50355298 A 19980729; PT 98937249 T 19980729; US 9815711 W 19980729