EP 1027480 A1 20000816 - ELECTRODES FOR SEMICONDUCTOR ELECTROPLATING APPARATUS AND THEIR APPLICATION
Title (en)
ELECTRODES FOR SEMICONDUCTOR ELECTROPLATING APPARATUS AND THEIR APPLICATION
Title (de)
ELEKTRODE FÜR HALBLEITERELEKTROBESCHICHTUNGSVORRICHTUNG UND IHRE ANWENDUNG
Title (fr)
ELECTRODES POUR APPAREIL D'ELECTRODEPOSITION A SEMI-CONDUCTEURS ET LEUR APPLICATION
Publication
Application
Priority
- US 9800799 W 19980114
- US 94052497 A 19970930
- US 94066997 A 19970930
- US 94068697 A 19970930
- US 98833397 A 19970930
- US 94068597 A 19970930
Abstract (en)
[origin: WO9931299A1] Wafer contact electrode assemblies (24) useful for supporting a wafer surface to be electroplated are disclosed herein. These fingers (235) provide electrical contact necessary for providing electric power between the wafer (55) and a corresponding anode in order to electroplate the surface wall of the wafer (55). Such conductive fingers (235) are useful in the production of electroplated products having reduced surface irregularities compared to products made by electroplating equipment and methods employing existing conductive fingers. In particular, the electrodes set forth herein are useful in electroplating apparatus and processes for the copper metallization of semiconductor wafers.
IPC 1-7
IPC 8 full level
C25D 7/12 (2006.01); C25D 17/04 (2006.01); H01L 21/00 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP)
H01L 21/67259 (2013.01); H01L 21/67769 (2013.01); H01L 21/67781 (2013.01); H01L 21/68721 (2013.01); H01L 21/68728 (2013.01); H01L 21/68785 (2013.01)
Citation (search report)
See references of WO 9931299A1
Designated contracting state (EPC)
AT CH DE FR GB LI NL
DOCDB simple family (publication)
WO 9931299 A1 19990624; AU 6026598 A 19990705; EP 1027480 A1 20000816; JP 2003522288 A 20030722
DOCDB simple family (application)
US 9800799 W 19980114; AU 6026598 A 19980114; EP 98903514 A 19980114; JP 2000539193 A 19980114