EP 1027728 A1 20000816 - COMPONENT AND METHOD FOR PRODUCTION THEREOF
Title (en)
COMPONENT AND METHOD FOR PRODUCTION THEREOF
Title (de)
BAUELEMENT UND VERFAHREN ZUM HERSTELLEN DES BAUELEMENTS
Title (fr)
COMPOSANT ET PROCEDE DE FABRICATION ASSOCIE
Publication
Application
Priority
- DE 19747846 A 19971030
- EP 9806295 W 19981002
Abstract (en)
[origin: DE19747846A1] The invention relates to a component and to a method for the production thereof. Said component is more particularly an electronic component with a micro electronic chip and a carrier which is produced by means of isothermal coagulation.
IPC 1-7
IPC 8 full level
H01L 23/40 (2006.01); B23K 20/10 (2006.01); H01L 21/52 (2006.01); H01L 21/607 (2006.01); H01L 23/482 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP KR US)
B23K 20/10 (2013.01 - EP US); H01L 23/4827 (2013.01 - EP KR US); H01L 23/49513 (2013.01 - EP KR US); H01L 24/29 (2013.01 - EP KR US); H01L 24/80 (2013.01 - EP US); H01L 24/83 (2013.01 - EP KR US); B23K 2101/40 (2018.07 - EP US); H01L 2224/29109 (2013.01 - KR); H01L 2224/29144 (2013.01 - KR); H01L 2224/83193 (2013.01 - EP US); H01L 2224/83409 (2013.01 - KR); H01L 2224/83444 (2013.01 - KR); H01L 2224/8381 (2013.01 - EP US); H01L 2224/83825 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01024 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/0132 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/10253 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US)
Citation (search report)
See references of WO 9923697A1
Designated contracting state (EPC)
DE ES FR GB IT SE
DOCDB simple family (publication)
DE 19747846 A1 19990506; CN 1139974 C 20040225; CN 1278363 A 20001227; EP 1027728 A1 20000816; JP 2001522143 A 20011113; KR 20010031563 A 20010416; TW 411592 B 20001111; US 6334567 B1 20020101; WO 9923697 A1 19990514
DOCDB simple family (application)
DE 19747846 A 19971030; CN 98810712 A 19981002; EP 9806295 W 19981002; EP 98951490 A 19981002; JP 2000519464 A 19981002; KR 20007004607 A 20000428; TW 87117545 A 19981023; US 53027300 A 20000428