Global Patent Index - EP 1027728 A1

EP 1027728 A1 2000-08-16 - COMPONENT AND METHOD FOR PRODUCTION THEREOF

Title (en)

COMPONENT AND METHOD FOR PRODUCTION THEREOF

Title (de)

BAUELEMENT UND VERFAHREN ZUM HERSTELLEN DES BAUELEMENTS

Title (fr)

COMPOSANT ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 1027728 A1 (DE)

Application

EP 98951490 A

Priority

  • DE 19747846 A
  • EP 9806295 W

Abstract (en)

[origin: DE19747846A1] The invention relates to a component and to a method for the production thereof. Said component is more particularly an electronic component with a micro electronic chip and a carrier which is produced by means of isothermal coagulation.

IPC 1-7 (main, further and additional classification)

H01L 21/607

IPC 8 full level (invention and additional information)

H01L 23/40 (2006.01); B23K 20/10 (2006.01); H01L 21/52 (2006.01); H01L 21/607 (2006.01); H01L 23/482 (2006.01); H01L 23/495 (2006.01)

CPC (invention and additional information)

H01L 24/80 (2013.01); B23K 20/10 (2013.01); H01L 23/4827 (2013.01); H01L 23/49513 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B23K 2201/40 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/351 (2013.01)

Combination set (CPC)

  1. H01L 2924/0132 + H01L 2924/01026 + H01L 2924/01028
  2. H01L 2924/0132 + H01L 2924/01049 + H01L 2924/01079
  3. H01L 2924/10253 + H01L 2924/00
  4. H01L 2924/351 + H01L 2924/00

Citation (search report)

See references of WO 9923697A1

Designated contracting state (EPC)

DE ES FR GB IT SE

EPO simple patent family

DE 19747846 A1 19990506; CN 1139974 C 20040225; CN 1278363 A 20001227; EP 1027728 A1 20000816; JP 2001522143 A 20011113; TW 411592 B 20001111; US 6334567 B1 20020101; WO 9923697 A1 19990514

INPADOC legal status


2003-12-03 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20030501

2000-08-16 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000331

2000-08-16 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE ES FR GB IT SE