EP 1029350 A4 20010131 - SPRING CLAMP ASSEMBLY FOR THERMAL STACKED COMPONENTS
Title (en)
SPRING CLAMP ASSEMBLY FOR THERMAL STACKED COMPONENTS
Title (de)
FEDERKLEMMENANORDNUNG FÜR STAPELKOMPONENTEN
Title (fr)
SYSTEME D'ETRIER A RESSORT POUR COMPOSANTS EMPILES EN CONTACT THERMIQUE
Publication
Application
Priority
US 9715562 W 19970904
Abstract (en)
[origin: CA2302357A1] A spring clamp device (14) providing a compressive stress to a stack of components includes a spring member (28) and a bracket (26) having attachment structure for engaging mating structure near the bottom of the stack. The bracket (26) is first engaged with the mating structure such that is straddles the stack. The spring member (28) is then latched to the bracket (26) under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket (26) and applying a downward reaction force to the top of the stack with the spring member (28). The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.
IPC 1-7
IPC 8 full level
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01)
CPC (source: EP)
H01L 2924/0002 (2013.01)
Citation (search report)
- [XA] US 5329426 A 19940712 - VILLANI ANGELO [US]
- [XA] DE 29620432 U1 19970206 - CHENG CHUN CHENG [TW]
- [A] US 5617292 A 19970401 - STEINER RONALD E [US]
- [A] CARUTHERS F: "ADVANCED PACKAGING BECOMES PRACTICAL FOR PORTABLES", COMPUTER DESIGN,PENNWELL PUBL. LITTLETON, MASSACHUSETTS,US, vol. 34, no. 3, 1 March 1995 (1995-03-01), pages 99 - 104, XP000504730, ISSN: 0010-4566
- See references of WO 9912202A1
Designated contracting state (EPC)
AT CH DE DK ES FI FR GB GR IE IT LI NL SE
DOCDB simple family (publication)
CA 2302357 A1 19990311; EP 1029350 A1 20000823; EP 1029350 A4 20010131; JP 2001515272 A 20010918
DOCDB simple family (application)
CA 2302357 A 19970904; EP 97939798 A 19970904; JP 2000509113 A 19970904