EP 1029351 A1 20000823 - NON-ELECTRICALLY CONDUCTIVE THERMAL DISSIPATOR FOR ELECTRONIC COMPONENTS
Title (en)
NON-ELECTRICALLY CONDUCTIVE THERMAL DISSIPATOR FOR ELECTRONIC COMPONENTS
Title (de)
ELEKTRISCH NICHTLEITENDER KEHLKERPER FÜRELEKTRONIKKOMPORENTEN
Title (fr)
MECANISME DE DISSIPATION DE LA CHALEUR NON ELECTROCONDUCTEUR POUR COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- US 9820621 W 19980929
- US 7089897 P 19971110
Abstract (en)
[origin: WO9925022A1] A thermal dissipator disposable in a heat transfer relationship with a heat-generating source, such as an electronic component, which is mounted on a substrate, such as a printed circuit board. The dissipator includes a thermal dissipation member having a top and bottom surface, and a pressure sensitive adhesive layer disposed on the thermal dissipation member to cover at least a portion of the bottom surface thereof. The dissipation member is formed of a thermally-conductive, electrically-nonconductive ceramic material. The pressure sensitive adhesive layer has an inner surface adhered to the bottom surface of the thermal dissipation member, and an outer surface bondable to a heat transfer surface of the source for attaching the dissipator to the source in a heat transfer relationship therewith.
IPC 1-7
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP)
H01L 23/3672 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01)
C-Set (source: EP)
Citation (search report)
See references of WO 9925022A1
Designated contracting state (EPC)
DE FR GB SE
DOCDB simple family (publication)
WO 9925022 A1 19990520; AU 9677498 A 19990531; EP 1029351 A1 20000823; JP 2001523047 A 20011120
DOCDB simple family (application)
US 9820621 W 19980929; AU 9677498 A 19980929; EP 98950829 A 19980929; JP 2000519924 A 19980929